APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL

A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transporte...

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1. Verfasser:	SOBEY, MARK, S
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	SOBEY, MARK, S
description	A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transported incrementally from the first scan-field position (38) to the second (37), third (38) and fourth (39) scan-field positions. The scanned focused laser beam (44A-D) in each scan-field position (36-38) scribes a portion of the groove pattern on the wafer (12), with scribing of the groove pattern being completed at the fourth (39) scan-field position. Un motif de sillons est inscrit dans une couche de nitrure de silicium sur une plaquette de silicium (12) au moyen de quatre faisceaux concentrés balayés indépendamment (44A-D) de rayons laser. Chaque faisceau concentré (44A, 44B, 44C, 44D) peut être balayé dans l'une des quatre positions de champ de balayage d'une table tournante (34). La plaquette (12) est transportée par incréments de la première position de champ de balayage (36) vers la deuxième (37), troisième (38) et quatrième (39) positions de champ de balayage. Le faisceau laser concentré balayé (44A-D) dans chaque position de champ de balayage (36-38) inscrit une partie du motif de sillons sur la plaquette (12), l'inscription du motif de sillons étant complétée à la quatrième position (39) du champ de balayage.
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Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transported incrementally from the first scan-field position (38) to the second (37), third (38) and fourth (39) scan-field positions. The scanned focused laser beam (44A-D) in each scan-field position (36-38) scribes a portion of the groove pattern on the wafer (12), with scribing of the groove pattern being completed at the fourth (39) scan-field position. Un motif de sillons est inscrit dans une couche de nitrure de silicium sur une plaquette de silicium (12) au moyen de quatre faisceaux concentrés balayés indépendamment (44A-D) de rayons laser. Chaque faisceau concentré (44A, 44B, 44C, 44D) peut être balayé dans l'une des quatre positions de champ de balayage d'une table tournante (34). La plaquette (12) est transportée par incréments de la première position de champ de balayage (36) vers la deuxième (37), troisième (38) et quatrième (39) positions de champ de balayage. Le faisceau laser concentré balayé (44A-D) dans chaque position de champ de balayage (36-38) inscrit une partie du motif de sillons sur la plaquette (12), l'inscription du motif de sillons étant complétée à la quatrième position (39) du champ de balayage.</description><language>eng ; fre</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=WO&NR=2010068410A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=WO&NR=2010068410A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOBEY, MARK, S</creatorcontrib><title>APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL</title><description>A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transported incrementally from the first scan-field position (38) to the second (37), third (38) and fourth (39) scan-field positions. The scanned focused laser beam (44A-D) in each scan-field position (36-38) scribes a portion of the groove pattern on the wafer (12), with scribing of the groove pattern being completed at the fourth (39) scan-field position. Un motif de sillons est inscrit dans une couche de nitrure de silicium sur une plaquette de silicium (12) au moyen de quatre faisceaux concentrés balayés indépendamment (44A-D) de rayons laser. Chaque faisceau concentré (44A, 44B, 44C, 44D) peut être balayé dans l'une des quatre positions de champ de balayage d'une table tournante (34). La plaquette (12) est transportée par incréments de la première position de champ de balayage (36) vers la deuxième (37), troisième (38) et quatrième (39) positions de champ de balayage. Le faisceau laser concentré balayé (44A-D) dans chaque position de champ de balayage (36-38) inscrit une partie du motif de sillons sur la plaquette (12), l'inscription du motif de sillons étant complétée à la quatrième position (39) du champ de balayage.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjcEKwjAQRHvxIOo_LHgWWhXxuk23NZAmZbNVeipF4klUqJ_iBxuhH-BlBuYNM_Pkg02DjNJ6KB2DQU8MXrHOta0AoUERYguuhIqdO5OH1k_ItIxGS_eD2hbUUBQrposDaC0V01xOWHtwFgpNhpSwVqAcSix4qrVytmiVxPc6ZqzRLJPZbbiPYTX5IlmXJOq0Ca9nH8bXcA2P8O4vbptmaXo47rMUs91_rS9LwkJz</recordid><startdate>20100617</startdate><enddate>20100617</enddate><creator>SOBEY, MARK, S</creator><scope>EVB</scope></search><sort><creationdate>20100617</creationdate><title>APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL</title><author>SOBEY, MARK, S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2010068410A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2010</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SOBEY, MARK, S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOBEY, MARK, S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL</title><date>2010-06-17</date><risdate>2010</risdate><abstract>A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transported incrementally from the first scan-field position (38) to the second (37), third (38) and fourth (39) scan-field positions. The scanned focused laser beam (44A-D) in each scan-field position (36-38) scribes a portion of the groove pattern on the wafer (12), with scribing of the groove pattern being completed at the fourth (39) scan-field position. Un motif de sillons est inscrit dans une couche de nitrure de silicium sur une plaquette de silicium (12) au moyen de quatre faisceaux concentrés balayés indépendamment (44A-D) de rayons laser. Chaque faisceau concentré (44A, 44B, 44C, 44D) peut être balayé dans l'une des quatre positions de champ de balayage d'une table tournante (34). La plaquette (12) est transportée par incréments de la première position de champ de balayage (36) vers la deuxième (37), troisième (38) et quatrième (39) positions de champ de balayage. Le faisceau laser concentré balayé (44A-D) dans chaque position de champ de balayage (36-38) inscrit une partie du motif de sillons sur la plaquette (12), l'inscription du motif de sillons étant complétée à la quatrième position (39) du champ de balayage.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL
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