INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION
lnertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and...
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| creator | KNOWLES, STUART, JOHN ANDERSON, ROBERT, ALBERT BERGER, WILLIAM, PAUL FRAZEE, MICHAEL, THOMAS COLLINS, MARK, ANDREW SMITH, THAD, W. (MARC) DRAGOTTI, VICTOR |
| description | lnertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and extending from the body for mounting the sensor and making connections with the circuitry.
L'invention concerne un capteur inertiel dont le corps comporte, sur ses faces opposées, une première et une seconde cavité, un élément de détection dans la première cavité, des circuits électroniques dans la seconde cavité, des conducteurs électriques reliant l'élément de détection et les circuits, et des fils reliés électriquement aux circuits et dépassant du corps pour effectuer le montage du capteur et les connexions avec les circuits. |
| format | Patent |
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L'invention concerne un capteur inertiel dont le corps comporte, sur ses faces opposées, une première et une seconde cavité, un élément de détection dans la première cavité, des circuits électroniques dans la seconde cavité, des conducteurs électriques reliant l'élément de détection et les circuits, et des fils reliés électriquement aux circuits et dépassant du corps pour effectuer le montage du capteur et les connexions avec les circuits.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=WO&NR=2010039453A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=WO&NR=2010039453A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KNOWLES, STUART, JOHN</creatorcontrib><creatorcontrib>ANDERSON, ROBERT, ALBERT</creatorcontrib><creatorcontrib>BERGER, WILLIAM, PAUL</creatorcontrib><creatorcontrib>FRAZEE, MICHAEL, THOMAS</creatorcontrib><creatorcontrib>COLLINS, MARK, ANDREW</creatorcontrib><creatorcontrib>SMITH, THAD, W. (MARC)</creatorcontrib><creatorcontrib>DRAGOTTI, VICTOR</creatorcontrib><title>INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION</title><description>lnertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and extending from the body for mounting the sensor and making connections with the circuitry.
L'invention concerne un capteur inertiel dont le corps comporte, sur ses faces opposées, une première et une seconde cavité, un élément de détection dans la première cavité, des circuits électroniques dans la seconde cavité, des conducteurs électriques reliant l'élément de détection et les circuits, et des fils reliés électriquement aux circuits et dépassant du corps pour effectuer le montage du capteur et les connexions avec les circuits.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDy9HMNCvF09FEIdvUL9g9SCPcM8VBwCQUKODuGeYZEKgQ4Ons7ursqOPq5KPi6hnj4uyj4uym4OToFeTo7hnj6-_EwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQwMDY0sTU2NHY2PiVAEAjOgrzg</recordid><startdate>20110127</startdate><enddate>20110127</enddate><creator>KNOWLES, STUART, JOHN</creator><creator>ANDERSON, ROBERT, ALBERT</creator><creator>BERGER, WILLIAM, PAUL</creator><creator>FRAZEE, MICHAEL, THOMAS</creator><creator>COLLINS, MARK, ANDREW</creator><creator>SMITH, THAD, W. (MARC)</creator><creator>DRAGOTTI, VICTOR</creator><scope>EVB</scope></search><sort><creationdate>20110127</creationdate><title>INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION</title><author>KNOWLES, STUART, JOHN ; ANDERSON, ROBERT, ALBERT ; BERGER, WILLIAM, PAUL ; FRAZEE, MICHAEL, THOMAS ; COLLINS, MARK, ANDREW ; SMITH, THAD, W. (MARC) ; DRAGOTTI, VICTOR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2010039453A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KNOWLES, STUART, JOHN</creatorcontrib><creatorcontrib>ANDERSON, ROBERT, ALBERT</creatorcontrib><creatorcontrib>BERGER, WILLIAM, PAUL</creatorcontrib><creatorcontrib>FRAZEE, MICHAEL, THOMAS</creatorcontrib><creatorcontrib>COLLINS, MARK, ANDREW</creatorcontrib><creatorcontrib>SMITH, THAD, W. (MARC)</creatorcontrib><creatorcontrib>DRAGOTTI, VICTOR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KNOWLES, STUART, JOHN</au><au>ANDERSON, ROBERT, ALBERT</au><au>BERGER, WILLIAM, PAUL</au><au>FRAZEE, MICHAEL, THOMAS</au><au>COLLINS, MARK, ANDREW</au><au>SMITH, THAD, W. (MARC)</au><au>DRAGOTTI, VICTOR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION</title><date>2011-01-27</date><risdate>2011</risdate><abstract>lnertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and extending from the body for mounting the sensor and making connections with the circuitry.
L'invention concerne un capteur inertiel dont le corps comporte, sur ses faces opposées, une première et une seconde cavité, un élément de détection dans la première cavité, des circuits électroniques dans la seconde cavité, des conducteurs électriques reliant l'élément de détection et les circuits, et des fils reliés électriquement aux circuits et dépassant du corps pour effectuer le montage du capteur et les connexions avec les circuits.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION |
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