INERTIAL SENSOR WITH DUAL CAVITY PACKAGE AND METHOD OF FABRICATION

lnertial sensor having a body with first and second cavities on opposite sides thereof, a sensing element in the first cavity, electronic circuitry in the second cavity, electrical conductors interconnecting the sensing element and the circuitry, and leads connected electrically to the circuitry and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KNOWLES, STUART, JOHN, ANDERSON, ROBERT, ALBERT, BERGER, WILLIAM, PAUL, FRAZEE, MICHAEL, THOMAS, COLLINS, MARK, ANDREW, SMITH, THAD, W. (MARC), DRAGOTTI, VICTOR
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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