LIQUID DIE BONDING AGENT
A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a hydrosilylation reaction inhibitor, and (E)...
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| creator | NAKANISHI, JUNJI HYUN, DAESUP FUJISAWA, TOYOHIKO |
| description | A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180°C to 400°C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.
L'invention concerne un agent de fixage de puce liquide comprenant : (A) un organopolysiloxane contenant au moins deux groupes alcényle dans une molécule ; (B) un organopolysiloxane contenant au moins deux atomes d'hydrogène liés à du silicium dans une molécule ; (C) un catalyseur de réaction d'hydrosilylation ; (D) un inhibiteur de réaction d'hydrosilylation ; et (E) un solvant organique pouvant dissoudre les composants (A, B et D), ledit solvant étant liquide et présentant un point d'ébullition compris entre 180°C et 400°C. L'agent de fixage de puce liquide selon l'invention contient également (F) un promoteur d'adhésion à base de composé d'organosilicium. |
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L'invention concerne un agent de fixage de puce liquide comprenant : (A) un organopolysiloxane contenant au moins deux groupes alcényle dans une molécule ; (B) un organopolysiloxane contenant au moins deux atomes d'hydrogène liés à du silicium dans une molécule ; (C) un catalyseur de réaction d'hydrosilylation ; (D) un inhibiteur de réaction d'hydrosilylation ; et (E) un solvant organique pouvant dissoudre les composants (A, B et D), ledit solvant étant liquide et présentant un point d'ébullition compris entre 180°C et 400°C. L'agent de fixage de puce liquide selon l'invention contient également (F) un promoteur d'adhésion à base de composé d'organosilicium.</description><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100325&DB=EPODOC&CC=WO&NR=2010032870A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100325&DB=EPODOC&CC=WO&NR=2010032870A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKANISHI, JUNJI</creatorcontrib><creatorcontrib>HYUN, DAESUP</creatorcontrib><creatorcontrib>FUJISAWA, TOYOHIKO</creatorcontrib><title>LIQUID DIE BONDING AGENT</title><description>A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180°C to 400°C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.
L'invention concerne un agent de fixage de puce liquide comprenant : (A) un organopolysiloxane contenant au moins deux groupes alcényle dans une molécule ; (B) un organopolysiloxane contenant au moins deux atomes d'hydrogène liés à du silicium dans une molécule ; (C) un catalyseur de réaction d'hydrosilylation ; (D) un inhibiteur de réaction d'hydrosilylation ; et (E) un solvant organique pouvant dissoudre les composants (A, B et D), ledit solvant étant liquide et présentant un point d'ébullition compris entre 180°C et 400°C. L'agent de fixage de puce liquide selon l'invention contient également (F) un promoteur d'adhésion à base de composé d'organosilicium.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDw8QwM9XRRcPF0VXDy93Px9HNXcHR39QvhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoYGBsZGFuYGjobGxKkCAFO0IEc</recordid><startdate>20100325</startdate><enddate>20100325</enddate><creator>NAKANISHI, JUNJI</creator><creator>HYUN, DAESUP</creator><creator>FUJISAWA, TOYOHIKO</creator><scope>EVB</scope></search><sort><creationdate>20100325</creationdate><title>LIQUID DIE BONDING AGENT</title><author>NAKANISHI, JUNJI ; HYUN, DAESUP ; FUJISAWA, TOYOHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2010032870A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2010</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKANISHI, JUNJI</creatorcontrib><creatorcontrib>HYUN, DAESUP</creatorcontrib><creatorcontrib>FUJISAWA, TOYOHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKANISHI, JUNJI</au><au>HYUN, DAESUP</au><au>FUJISAWA, TOYOHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIQUID DIE BONDING AGENT</title><date>2010-03-25</date><risdate>2010</risdate><abstract>A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180°C to 400°C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.
L'invention concerne un agent de fixage de puce liquide comprenant : (A) un organopolysiloxane contenant au moins deux groupes alcényle dans une molécule ; (B) un organopolysiloxane contenant au moins deux atomes d'hydrogène liés à du silicium dans une molécule ; (C) un catalyseur de réaction d'hydrosilylation ; (D) un inhibiteur de réaction d'hydrosilylation ; et (E) un solvant organique pouvant dissoudre les composants (A, B et D), ledit solvant étant liquide et présentant un point d'ébullition compris entre 180°C et 400°C. L'agent de fixage de puce liquide selon l'invention contient également (F) un promoteur d'adhésion à base de composé d'organosilicium.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | LIQUID DIE BONDING AGENT |
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