METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS
Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after plating processes are provided. In particular, solutions are provided which are free of oxidizing agents and include a non-metal pH adjusting agent in sufficient concentration such that the s...
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| description | Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after plating processes are provided. In particular, solutions are provided which are free of oxidizing agents and include a non-metal pH adjusting agent in sufficient concentration such that the solution has a pH between approximately 7.5 and approximately 12.0. In some cases, a solution may include a chelating agent. In addition or alternatively, a solution may include at least two different types of complexing agents each offering a single point of attachment for binding metal ions via respectively different functional groups. In any case, at least one of the complexing agents or the chelating agent includes a non-amine or non-imine functional group. An embodiment of a method for processing a substrate includes plating a metal layer upon the substrate and subsequently exposing the substrate to a solution comprising the aforementioned make-up.
L'invention porte sur des procédés et des solutions pour empêcher la formation de matière de défaut de particules métalliques sur un substrat après des procédés de placage. En particulier, l'invention porte sur des solutions qui sont exemptes d'agents oxydants et contiennent un correcteur d'acidité non métallique dans une concentration suffisante de manière à ce que le pH de la solution soit compris entre approximativement 7,5 et approximativement 12,0. Dans certains cas, une solution peut contenir un agent chélatant. De plus ou en variante, une solution peut contenir au moins deux types différents d'agents complexants offrant chacun un unique point de fixation pour la liaison d'ions métalliques par l'intermédiaire de groupes fonctionnels respectivement différents. Dans n'importe quel cas, au moins l'un parmi les agents complexants ou l'agent chélatant comporte un groupe fonctionnel non amine ou non imine. Un mode de réalisation d'un procédé pour traiter un substrat comprend le placage d'une couche de métal sur le substrat et l'exposition ultérieure du substrat à une solution contenant la préparation susmentionnée. |
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L'invention porte sur des procédés et des solutions pour empêcher la formation de matière de défaut de particules métalliques sur un substrat après des procédés de placage. En particulier, l'invention porte sur des solutions qui sont exemptes d'agents oxydants et contiennent un correcteur d'acidité non métallique dans une concentration suffisante de manière à ce que le pH de la solution soit compris entre approximativement 7,5 et approximativement 12,0. Dans certains cas, une solution peut contenir un agent chélatant. De plus ou en variante, une solution peut contenir au moins deux types différents d'agents complexants offrant chacun un unique point de fixation pour la liaison d'ions métalliques par l'intermédiaire de groupes fonctionnels respectivement différents. Dans n'importe quel cas, au moins l'un parmi les agents complexants ou l'agent chélatant comporte un groupe fonctionnel non amine ou non imine. Un mode de réalisation d'un procédé pour traiter un substrat comprend le placage d'une couche de métal sur le substrat et l'exposition ultérieure du substrat à une solution contenant la préparation susmentionnée.</description><language>eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=WO&NR=2010027950A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=WO&NR=2010027950A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARUNAGIRI, TIRUCHIRAPALLI, N</creatorcontrib><creatorcontrib>LI, SHIJIAN</creatorcontrib><creatorcontrib>KOLICS, ARTUR, K</creatorcontrib><title>METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS</title><description>Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after plating processes are provided. In particular, solutions are provided which are free of oxidizing agents and include a non-metal pH adjusting agent in sufficient concentration such that the solution has a pH between approximately 7.5 and approximately 12.0. In some cases, a solution may include a chelating agent. In addition or alternatively, a solution may include at least two different types of complexing agents each offering a single point of attachment for binding metal ions via respectively different functional groups. In any case, at least one of the complexing agents or the chelating agent includes a non-amine or non-imine functional group. An embodiment of a method for processing a substrate includes plating a metal layer upon the substrate and subsequently exposing the substrate to a solution comprising the aforementioned make-up.
L'invention porte sur des procédés et des solutions pour empêcher la formation de matière de défaut de particules métalliques sur un substrat après des procédés de placage. En particulier, l'invention porte sur des solutions qui sont exemptes d'agents oxydants et contiennent un correcteur d'acidité non métallique dans une concentration suffisante de manière à ce que le pH de la solution soit compris entre approximativement 7,5 et approximativement 12,0. Dans certains cas, une solution peut contenir un agent chélatant. De plus ou en variante, une solution peut contenir au moins deux types différents d'agents complexants offrant chacun un unique point de fixation pour la liaison d'ions métalliques par l'intermédiaire de groupes fonctionnels respectivement différents. Dans n'importe quel cas, au moins l'un parmi les agents complexants ou l'agent chélatant comporte un groupe fonctionnel non amine ou non imine. 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In particular, solutions are provided which are free of oxidizing agents and include a non-metal pH adjusting agent in sufficient concentration such that the solution has a pH between approximately 7.5 and approximately 12.0. In some cases, a solution may include a chelating agent. In addition or alternatively, a solution may include at least two different types of complexing agents each offering a single point of attachment for binding metal ions via respectively different functional groups. In any case, at least one of the complexing agents or the chelating agent includes a non-amine or non-imine functional group. An embodiment of a method for processing a substrate includes plating a metal layer upon the substrate and subsequently exposing the substrate to a solution comprising the aforementioned make-up.
L'invention porte sur des procédés et des solutions pour empêcher la formation de matière de défaut de particules métalliques sur un substrat après des procédés de placage. En particulier, l'invention porte sur des solutions qui sont exemptes d'agents oxydants et contiennent un correcteur d'acidité non métallique dans une concentration suffisante de manière à ce que le pH de la solution soit compris entre approximativement 7,5 et approximativement 12,0. Dans certains cas, une solution peut contenir un agent chélatant. De plus ou en variante, une solution peut contenir au moins deux types différents d'agents complexants offrant chacun un unique point de fixation pour la liaison d'ions métalliques par l'intermédiaire de groupes fonctionnels respectivement différents. Dans n'importe quel cas, au moins l'un parmi les agents complexants ou l'agent chélatant comporte un groupe fonctionnel non amine ou non imine. Un mode de réalisation d'un procédé pour traiter un substrat comprend le placage d'une couche de métal sur le substrat et l'exposition ultérieure du substrat à une solution contenant la préparation susmentionnée.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS |
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