AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) silica particles and (B1) an organic acid. The silica particles (A) have such a chemical property that the number of silanol groups as calculated based on the signal area of the 29Si-NMR spectrum is within the r...
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| creator | SHIMIZU, TAKAFUMI UCHIKURA, KAZUHITO IKEDA, MASATOSHI ANDOU, MICHIAKI KUBOUCHI, SHOU SHIBATA, YOUSUKE SHIDA, HIROTAKA TAKEMURA, AKIHIRO |
| description | Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) silica particles and (B1) an organic acid. The silica particles (A) have such a chemical property that the number of silanol groups as calculated based on the signal area of the 29Si-NMR spectrum is within the range from 2.0 × 1021 to 3.0 × 1021 groups/g.
L'invention porte sur une dispersion aqueuse pour polissage mécanochimique qui contient (A) des particules de silice et (B1) un acide organique. Les particules de silice (A) ont une propriété chimique telle que le nombre de groupes silanol calculé selon l'aire de signal du spectre de résonance magnétique nucléaire 29Si se situe entre 2,0 × 1021 et 3,0 × 1021 groupes/g. |
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L'invention porte sur une dispersion aqueuse pour polissage mécanochimique qui contient (A) des particules de silice et (B1) un acide organique. Les particules de silice (A) ont une propriété chimique telle que le nombre de groupes silanol calculé selon l'aire de signal du spectre de résonance magnétique nucléaire 29Si se situe entre 2,0 × 1021 et 3,0 × 1021 groupes/g.</description><language>eng ; fre ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090827&DB=EPODOC&CC=WO&NR=2009104517A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090827&DB=EPODOC&CC=WO&NR=2009104517A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMIZU, TAKAFUMI</creatorcontrib><creatorcontrib>UCHIKURA, KAZUHITO</creatorcontrib><creatorcontrib>IKEDA, MASATOSHI</creatorcontrib><creatorcontrib>ANDOU, MICHIAKI</creatorcontrib><creatorcontrib>KUBOUCHI, SHOU</creatorcontrib><creatorcontrib>SHIBATA, YOUSUKE</creatorcontrib><creatorcontrib>SHIDA, HIROTAKA</creatorcontrib><creatorcontrib>TAKEMURA, AKIHIRO</creatorcontrib><title>AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD</title><description>Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) silica particles and (B1) an organic acid. The silica particles (A) have such a chemical property that the number of silanol groups as calculated based on the signal area of the 29Si-NMR spectrum is within the range from 2.0 × 1021 to 3.0 × 1021 groups/g.
L'invention porte sur une dispersion aqueuse pour polissage mécanochimique qui contient (A) des particules de silice et (B1) un acide organique. Les particules de silice (A) ont une propriété chimique telle que le nombre de groupes silanol calculé selon l'aire de signal du spectre de résonance magnétique nucléaire 29Si se situe entre 2,0 × 1021 et 3,0 × 1021 groupes/g.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh1DAx19Q8NVnDxDA5wDQr29PdTcPMPUnD2cPX1dHb0UfB1dfZw9AMzA_x9PIM9PP3cFRz9XAio8HUN8fB34WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGloYGJqaG5o6GxsSpAgClNDNc</recordid><startdate>20090827</startdate><enddate>20090827</enddate><creator>SHIMIZU, TAKAFUMI</creator><creator>UCHIKURA, KAZUHITO</creator><creator>IKEDA, MASATOSHI</creator><creator>ANDOU, MICHIAKI</creator><creator>KUBOUCHI, SHOU</creator><creator>SHIBATA, YOUSUKE</creator><creator>SHIDA, HIROTAKA</creator><creator>TAKEMURA, AKIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20090827</creationdate><title>AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD</title><author>SHIMIZU, TAKAFUMI ; UCHIKURA, KAZUHITO ; IKEDA, MASATOSHI ; ANDOU, MICHIAKI ; KUBOUCHI, SHOU ; SHIBATA, YOUSUKE ; SHIDA, HIROTAKA ; TAKEMURA, AKIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2009104517A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMIZU, TAKAFUMI</creatorcontrib><creatorcontrib>UCHIKURA, KAZUHITO</creatorcontrib><creatorcontrib>IKEDA, MASATOSHI</creatorcontrib><creatorcontrib>ANDOU, MICHIAKI</creatorcontrib><creatorcontrib>KUBOUCHI, SHOU</creatorcontrib><creatorcontrib>SHIBATA, YOUSUKE</creatorcontrib><creatorcontrib>SHIDA, HIROTAKA</creatorcontrib><creatorcontrib>TAKEMURA, AKIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMIZU, TAKAFUMI</au><au>UCHIKURA, KAZUHITO</au><au>IKEDA, MASATOSHI</au><au>ANDOU, MICHIAKI</au><au>KUBOUCHI, SHOU</au><au>SHIBATA, YOUSUKE</au><au>SHIDA, HIROTAKA</au><au>TAKEMURA, AKIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD</title><date>2009-08-27</date><risdate>2009</risdate><abstract>Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) silica particles and (B1) an organic acid. The silica particles (A) have such a chemical property that the number of silanol groups as calculated based on the signal area of the 29Si-NMR spectrum is within the range from 2.0 × 1021 to 3.0 × 1021 groups/g.
L'invention porte sur une dispersion aqueuse pour polissage mécanochimique qui contient (A) des particules de silice et (B1) un acide organique. Les particules de silice (A) ont une propriété chimique telle que le nombre de groupes silanol calculé selon l'aire de signal du spectre de résonance magnétique nucléaire 29Si se situe entre 2,0 × 1021 et 3,0 × 1021 groupes/g.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD |
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