SAWING APPARATUS
The present invention provides a sawing apparatus which can cut a workpiece into minute pieces and maximize cutting efficiency. The sawing apparatus includes a first arbor (110), a second arbor (120), an arbor base (140) and a work table (160). The first arbor is coupled to the first motor. First bl...
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| creator | CHOI, JAE GOO LEE, HAE DONG KIM, SUNG CHUL JANG, MAN SUK |
| description | The present invention provides a sawing apparatus which can cut a workpiece into minute pieces and maximize cutting efficiency. The sawing apparatus includes a first arbor (110), a second arbor (120), an arbor base (140) and a work table (160). The first arbor is coupled to the first motor. First blades (115) are provided on the outer surface of the first arbor at regular intervals. The second arbor is oriented parallel to the first arbor and coupled to the first motor. Second blades (125) are provided on the outer surface of the second arbor at regular intervals. The first arbor and the second arbor are coupled to the respective opposite ends of the arbor base. The work table is provided below the arbor base so as to be movable in a longitudinal direction and rotatable in a horizontal direction. The work table supports the workpiece thereon.
Appareil de sciage permettant de découper une pièce en très petits éléments minuscules l'efficacité du sciage. Ledit appareil comprend un premier mandrin (110), un second mandrin (120), une base de mandrin (140) et un plateau de travail (160). Le premier mandrin est raccordé à un premier moteur. La surface extérieure du premier mandrin est munie de premières lames (115) disposées à intervalles réguliers. Le second mandrin est orienté parallèlement au premier mandrin et est raccordé au premier moteur. La surface extérieure du second mandrin est munie de secondes lames (125) disposés à intervalles réguliers. Le premier et le second mandrin sont raccordées aux extrémités opposée de la base de mandrin, respectivement. Le plateau disposé sous la base de mandrin peut se déplacer dans le sens longitudinal et pivoter dans le plan horizontal. |
| format | Patent |
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Appareil de sciage permettant de découper une pièce en très petits éléments minuscules l'efficacité du sciage. Ledit appareil comprend un premier mandrin (110), un second mandrin (120), une base de mandrin (140) et un plateau de travail (160). Le premier mandrin est raccordé à un premier moteur. La surface extérieure du premier mandrin est munie de premières lames (115) disposées à intervalles réguliers. Le second mandrin est orienté parallèlement au premier mandrin et est raccordé au premier moteur. La surface extérieure du second mandrin est munie de secondes lames (125) disposés à intervalles réguliers. Le premier et le second mandrin sont raccordées aux extrémités opposée de la base de mandrin, respectivement. Le plateau disposé sous la base de mandrin peut se déplacer dans le sens longitudinal et pivoter dans le plan horizontal.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090618&DB=EPODOC&CC=WO&NR=2009057968A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090618&DB=EPODOC&CC=WO&NR=2009057968A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, JAE GOO</creatorcontrib><creatorcontrib>LEE, HAE DONG</creatorcontrib><creatorcontrib>KIM, SUNG CHUL</creatorcontrib><creatorcontrib>JANG, MAN SUK</creatorcontrib><title>SAWING APPARATUS</title><description>The present invention provides a sawing apparatus which can cut a workpiece into minute pieces and maximize cutting efficiency. The sawing apparatus includes a first arbor (110), a second arbor (120), an arbor base (140) and a work table (160). The first arbor is coupled to the first motor. First blades (115) are provided on the outer surface of the first arbor at regular intervals. The second arbor is oriented parallel to the first arbor and coupled to the first motor. Second blades (125) are provided on the outer surface of the second arbor at regular intervals. The first arbor and the second arbor are coupled to the respective opposite ends of the arbor base. The work table is provided below the arbor base so as to be movable in a longitudinal direction and rotatable in a horizontal direction. The work table supports the workpiece thereon.
Appareil de sciage permettant de découper une pièce en très petits éléments minuscules l'efficacité du sciage. Ledit appareil comprend un premier mandrin (110), un second mandrin (120), une base de mandrin (140) et un plateau de travail (160). Le premier mandrin est raccordé à un premier moteur. La surface extérieure du premier mandrin est munie de premières lames (115) disposées à intervalles réguliers. Le second mandrin est orienté parallèlement au premier mandrin et est raccordé au premier moteur. La surface extérieure du second mandrin est munie de secondes lames (125) disposés à intervalles réguliers. Le premier et le second mandrin sont raccordées aux extrémités opposée de la base de mandrin, respectivement. Le plateau disposé sous la base de mandrin peut se déplacer dans le sens longitudinal et pivoter dans le plan horizontal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAIdgz39HNXcAwIcAxyDAkN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGlgam5pZmFo7GxsSpAgCDkx6h</recordid><startdate>20090618</startdate><enddate>20090618</enddate><creator>CHOI, JAE GOO</creator><creator>LEE, HAE DONG</creator><creator>KIM, SUNG CHUL</creator><creator>JANG, MAN SUK</creator><scope>EVB</scope></search><sort><creationdate>20090618</creationdate><title>SAWING APPARATUS</title><author>CHOI, JAE GOO ; LEE, HAE DONG ; KIM, SUNG CHUL ; JANG, MAN SUK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2009057968A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, JAE GOO</creatorcontrib><creatorcontrib>LEE, HAE DONG</creatorcontrib><creatorcontrib>KIM, SUNG CHUL</creatorcontrib><creatorcontrib>JANG, MAN SUK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, JAE GOO</au><au>LEE, HAE DONG</au><au>KIM, SUNG CHUL</au><au>JANG, MAN SUK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SAWING APPARATUS</title><date>2009-06-18</date><risdate>2009</risdate><abstract>The present invention provides a sawing apparatus which can cut a workpiece into minute pieces and maximize cutting efficiency. The sawing apparatus includes a first arbor (110), a second arbor (120), an arbor base (140) and a work table (160). The first arbor is coupled to the first motor. First blades (115) are provided on the outer surface of the first arbor at regular intervals. The second arbor is oriented parallel to the first arbor and coupled to the first motor. Second blades (125) are provided on the outer surface of the second arbor at regular intervals. The first arbor and the second arbor are coupled to the respective opposite ends of the arbor base. The work table is provided below the arbor base so as to be movable in a longitudinal direction and rotatable in a horizontal direction. The work table supports the workpiece thereon.
Appareil de sciage permettant de découper une pièce en très petits éléments minuscules l'efficacité du sciage. Ledit appareil comprend un premier mandrin (110), un second mandrin (120), une base de mandrin (140) et un plateau de travail (160). Le premier mandrin est raccordé à un premier moteur. La surface extérieure du premier mandrin est munie de premières lames (115) disposées à intervalles réguliers. Le second mandrin est orienté parallèlement au premier mandrin et est raccordé au premier moteur. La surface extérieure du second mandrin est munie de secondes lames (125) disposés à intervalles réguliers. Le premier et le second mandrin sont raccordées aux extrémités opposée de la base de mandrin, respectivement. Le plateau disposé sous la base de mandrin peut se déplacer dans le sens longitudinal et pivoter dans le plan horizontal.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | SAWING APPARATUS |
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