ELECTRONICS PACKAGE AND MANUFACTURING METHOD THEREOF

A method for manufacturing an electronics package is provided that comprises forming at least one module block by providing a carrier substrate having a recess, placing at least one electronic component die in said recess, filling said recess with a molding material, and depositing a circuit layer c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAENTYSALO, MATTI, MOLKKARI, PETRI, MIETTINEN, JANI, VALTANEN, JANI, MANSIKKAMAEKI, PAULINA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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