COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION
A cleaning agent, a composition including the agent, and methods of forming and using the agent and composition are disclosed. The agent is formed by combining an organic acid and an amine in the presence in a base to form a compound for chelating copper ions. The composition optionally includes dil...
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| creator | ZAKI, NAEL, N |
| description | A cleaning agent, a composition including the agent, and methods of forming and using the agent and composition are disclosed. The agent is formed by combining an organic acid and an amine in the presence in a base to form a compound for chelating copper ions. The composition optionally includes diluents, surfactants, sequestering agents, corrosion inhibitors and/or thickening agents.
La présente invention comprend un agent nettoyant, une composition comprenant l'agent et des procédés de formation et d'utilisation de l'agent et de la composition. L'agent est formé en combinant un acide organique et une amine en présence d'une base pour former un composé destiné à chélater les ions cuivre. La composition comprend facultativement des diluants, des agents tensioactifs, des agents séquestrants, des inhibiteurs de la corrosion et/ou des épaississants. |
| format | Patent |
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La présente invention comprend un agent nettoyant, une composition comprenant l'agent et des procédés de formation et d'utilisation de l'agent et de la composition. L'agent est formé en combinant un acide organique et une amine en présence d'une base pour former un composé destiné à chélater les ions cuivre. La composition comprend facultativement des diluants, des agents tensioactifs, des agents séquestrants, des inhibiteurs de la corrosion et/ou des épaississants.</description><language>eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080814&DB=EPODOC&CC=WO&NR=2008048240A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080814&DB=EPODOC&CC=WO&NR=2008048240A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZAKI, NAEL, N</creatorcontrib><title>COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION</title><description>A cleaning agent, a composition including the agent, and methods of forming and using the agent and composition are disclosed. The agent is formed by combining an organic acid and an amine in the presence in a base to form a compound for chelating copper ions. The composition optionally includes diluents, surfactants, sequestering agents, corrosion inhibitors and/or thickening agents.
La présente invention comprend un agent nettoyant, une composition comprenant l'agent et des procédés de formation et d'utilisation de l'agent et de la composition. L'agent est formé en combinant un acide organique et une amine en présence d'une base pour former un composé destiné à chélater les ions cuivre. La composition comprend facultativement des diluants, des agents tensioactifs, des agents séquestrants, des inhibiteurs de la corrosion et/ou des épaississants.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCh29g8IcA1ScPZw9XEM8fRzV3B0d_UL0VFw9vcN8A_2DPH091Pw9HP2CXUBSYZ4uMIUOPq5KPi6hnj4uwQr-LspuPkH-YK1A4VDg1HUgsWQzONhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGBhYGJhZGJgaOxsbEqQIAErk5BA</recordid><startdate>20080814</startdate><enddate>20080814</enddate><creator>ZAKI, NAEL, N</creator><scope>EVB</scope></search><sort><creationdate>20080814</creationdate><title>COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION</title><author>ZAKI, NAEL, N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2008048240A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2008</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><toplevel>online_resources</toplevel><creatorcontrib>ZAKI, NAEL, N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZAKI, NAEL, N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION</title><date>2008-08-14</date><risdate>2008</risdate><abstract>A cleaning agent, a composition including the agent, and methods of forming and using the agent and composition are disclosed. The agent is formed by combining an organic acid and an amine in the presence in a base to form a compound for chelating copper ions. The composition optionally includes diluents, surfactants, sequestering agents, corrosion inhibitors and/or thickening agents.
La présente invention comprend un agent nettoyant, une composition comprenant l'agent et des procédés de formation et d'utilisation de l'agent et de la composition. L'agent est formé en combinant un acide organique et une amine en présence d'une base pour former un composé destiné à chélater les ions cuivre. La composition comprend facultativement des diluants, des agents tensioactifs, des agents séquestrants, des inhibiteurs de la corrosion et/ou des épaississants.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2008048240A3 |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T16%3A23%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZAKI,%20NAEL,%20N&rft.date=2008-08-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2008048240A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |