THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattic...
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| creator | WEISER, MARTIN, W RASTOGI, RAVI MATHUR, DEVESH TONG, COLIN NERURKAR, MEGHANA |
| description | Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
L'invention concerne des composants et des matériaux, comprenant des matériaux d'interface thermique, qui comprennent au moins un composant de matrice, au moins un composant de conductivité élevée, et au moins un matériau de soudure. Dans certains modes de réalisation, au moins un composant de conductivité élevée comprend un composant de charge, un composant réseau ou une combinaison de ceux-ci. L'invention concerne également des procédés de production d'un matériau d'interface thermique qui comprend la fourniture d'au moins un composant de matrice, la fourniture d'au moins un composant de conductivité élevée, la fourniture d'au moins un matériau de soudure, le mélange du composant de matrice, du composant de conductivité élevée et du matériau de soudure. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2008014171A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2008014171A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2008014171A33</originalsourceid><addsrcrecordid>eNrjZAgJ8XAN8nX0UfD0C3ENcvb383N1DlFw9HOBCLg5Orsq-DoCWZ6OPsE6Cr6uIR7-LsEK_m4KAUH-LqHOIZ7-fmDlocGuwQogw1z93XgYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBgYWBoYmhuaGjsTFxqgDtGTD6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF</title><source>esp@cenet</source><creator>WEISER, MARTIN, W ; RASTOGI, RAVI ; MATHUR, DEVESH ; TONG, COLIN ; NERURKAR, MEGHANA</creator><creatorcontrib>WEISER, MARTIN, W ; RASTOGI, RAVI ; MATHUR, DEVESH ; TONG, COLIN ; NERURKAR, MEGHANA</creatorcontrib><description>Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
L'invention concerne des composants et des matériaux, comprenant des matériaux d'interface thermique, qui comprennent au moins un composant de matrice, au moins un composant de conductivité élevée, et au moins un matériau de soudure. Dans certains modes de réalisation, au moins un composant de conductivité élevée comprend un composant de charge, un composant réseau ou une combinaison de ceux-ci. L'invention concerne également des procédés de production d'un matériau d'interface thermique qui comprend la fourniture d'au moins un composant de matrice, la fourniture d'au moins un composant de conductivité élevée, la fourniture d'au moins un matériau de soudure, le mélange du composant de matrice, du composant de conductivité élevée et du matériau de soudure.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080320&DB=EPODOC&CC=WO&NR=2008014171A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080320&DB=EPODOC&CC=WO&NR=2008014171A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEISER, MARTIN, W</creatorcontrib><creatorcontrib>RASTOGI, RAVI</creatorcontrib><creatorcontrib>MATHUR, DEVESH</creatorcontrib><creatorcontrib>TONG, COLIN</creatorcontrib><creatorcontrib>NERURKAR, MEGHANA</creatorcontrib><title>THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF</title><description>Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
L'invention concerne des composants et des matériaux, comprenant des matériaux d'interface thermique, qui comprennent au moins un composant de matrice, au moins un composant de conductivité élevée, et au moins un matériau de soudure. Dans certains modes de réalisation, au moins un composant de conductivité élevée comprend un composant de charge, un composant réseau ou une combinaison de ceux-ci. L'invention concerne également des procédés de production d'un matériau d'interface thermique qui comprend la fourniture d'au moins un composant de matrice, la fourniture d'au moins un composant de conductivité élevée, la fourniture d'au moins un matériau de soudure, le mélange du composant de matrice, du composant de conductivité élevée et du matériau de soudure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgJ8XAN8nX0UfD0C3ENcvb383N1DlFw9HOBCLg5Orsq-DoCWZ6OPsE6Cr6uIR7-LsEK_m4KAUH-LqHOIZ7-fmDlocGuwQogw1z93XgYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBgYWBoYmhuaGjsTFxqgDtGTD6</recordid><startdate>20080320</startdate><enddate>20080320</enddate><creator>WEISER, MARTIN, W</creator><creator>RASTOGI, RAVI</creator><creator>MATHUR, DEVESH</creator><creator>TONG, COLIN</creator><creator>NERURKAR, MEGHANA</creator><scope>EVB</scope></search><sort><creationdate>20080320</creationdate><title>THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF</title><author>WEISER, MARTIN, W ; RASTOGI, RAVI ; MATHUR, DEVESH ; TONG, COLIN ; NERURKAR, MEGHANA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2008014171A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WEISER, MARTIN, W</creatorcontrib><creatorcontrib>RASTOGI, RAVI</creatorcontrib><creatorcontrib>MATHUR, DEVESH</creatorcontrib><creatorcontrib>TONG, COLIN</creatorcontrib><creatorcontrib>NERURKAR, MEGHANA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEISER, MARTIN, W</au><au>RASTOGI, RAVI</au><au>MATHUR, DEVESH</au><au>TONG, COLIN</au><au>NERURKAR, MEGHANA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF</title><date>2008-03-20</date><risdate>2008</risdate><abstract>Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
L'invention concerne des composants et des matériaux, comprenant des matériaux d'interface thermique, qui comprennent au moins un composant de matrice, au moins un composant de conductivité élevée, et au moins un matériau de soudure. Dans certains modes de réalisation, au moins un composant de conductivité élevée comprend un composant de charge, un composant réseau ou une combinaison de ceux-ci. L'invention concerne également des procédés de production d'un matériau d'interface thermique qui comprend la fourniture d'au moins un composant de matrice, la fourniture d'au moins un composant de conductivité élevée, la fourniture d'au moins un matériau de soudure, le mélange du composant de matrice, du composant de conductivité élevée et du matériau de soudure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF |
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