STRUCTURE AND METHOD OF MAKING LIDDED CHIPS

Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GOUDGE, CHARLES, LIAM, NYSTROM, MICHAEL, J, TUCKERMAN, DAVID, B, HUMPSTON, GILES, WOLL, ANITA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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