STRUCTURE AND METHOD OF MAKING LIDDED CHIPS
Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chi...
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| creator | GOUDGE, CHARLES, LIAM NYSTROM, MICHAEL, J TUCKERMAN, DAVID, B HUMPSTON, GILES WOLL, ANITA |
| description | Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures (2901) and assemblies (3031) including lidded chips are also provided.
La présente invention concerne des procédés permettant de fabriquer des puces encapsulées (2901) pourvues de couches protectrices, par exemple, de couvercles (2912) ou d'autres couches sus-jacentes (2903) présentant des caractéristiques transparentes, partiellement transparentes ou opaques ou bien une combinaison de toutes ces caractéristiques. L'invention a trait à des procédés destinés à la fabrication de puces encapsulées. L'invention porte aussi sur des structures de puces à couvercle (2901) et des ensembles (3031) comprenant des puces à couvercle. |
| format | Patent |
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La présente invention concerne des procédés permettant de fabriquer des puces encapsulées (2901) pourvues de couches protectrices, par exemple, de couvercles (2912) ou d'autres couches sus-jacentes (2903) présentant des caractéristiques transparentes, partiellement transparentes ou opaques ou bien une combinaison de toutes ces caractéristiques. L'invention a trait à des procédés destinés à la fabrication de puces encapsulées. L'invention porte aussi sur des structures de puces à couvercle (2901) et des ensembles (3031) comprenant des puces à couvercle.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080214&DB=EPODOC&CC=WO&NR=2007103224A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080214&DB=EPODOC&CC=WO&NR=2007103224A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOUDGE, CHARLES, LIAM</creatorcontrib><creatorcontrib>NYSTROM, MICHAEL, J</creatorcontrib><creatorcontrib>TUCKERMAN, DAVID, B</creatorcontrib><creatorcontrib>HUMPSTON, GILES</creatorcontrib><creatorcontrib>WOLL, ANITA</creatorcontrib><title>STRUCTURE AND METHOD OF MAKING LIDDED CHIPS</title><description>Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures (2901) and assemblies (3031) including lidded chips are also provided.
La présente invention concerne des procédés permettant de fabriquer des puces encapsulées (2901) pourvues de couches protectrices, par exemple, de couvercles (2912) ou d'autres couches sus-jacentes (2903) présentant des caractéristiques transparentes, partiellement transparentes ou opaques ou bien une combinaison de toutes ces caractéristiques. L'invention a trait à des procédés destinés à la fabrication de puces encapsulées. L'invention porte aussi sur des structures de puces à couvercle (2901) et des ensembles (3031) comprenant des puces à couvercle.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAODgkKdQ4JDXJVcPRzUfB1DfHwd1Hwd1PwdfT29HNX8PF0cXF1UXD28AwI5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYG5oYGxkZGJo7GxsSpAgDsmiV-</recordid><startdate>20080214</startdate><enddate>20080214</enddate><creator>GOUDGE, CHARLES, LIAM</creator><creator>NYSTROM, MICHAEL, J</creator><creator>TUCKERMAN, DAVID, B</creator><creator>HUMPSTON, GILES</creator><creator>WOLL, ANITA</creator><scope>EVB</scope></search><sort><creationdate>20080214</creationdate><title>STRUCTURE AND METHOD OF MAKING LIDDED CHIPS</title><author>GOUDGE, CHARLES, LIAM ; NYSTROM, MICHAEL, J ; TUCKERMAN, DAVID, B ; HUMPSTON, GILES ; WOLL, ANITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2007103224A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GOUDGE, CHARLES, LIAM</creatorcontrib><creatorcontrib>NYSTROM, MICHAEL, J</creatorcontrib><creatorcontrib>TUCKERMAN, DAVID, B</creatorcontrib><creatorcontrib>HUMPSTON, GILES</creatorcontrib><creatorcontrib>WOLL, ANITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOUDGE, CHARLES, LIAM</au><au>NYSTROM, MICHAEL, J</au><au>TUCKERMAN, DAVID, B</au><au>HUMPSTON, GILES</au><au>WOLL, ANITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>STRUCTURE AND METHOD OF MAKING LIDDED CHIPS</title><date>2008-02-14</date><risdate>2008</risdate><abstract>Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures (2901) and assemblies (3031) including lidded chips are also provided.
La présente invention concerne des procédés permettant de fabriquer des puces encapsulées (2901) pourvues de couches protectrices, par exemple, de couvercles (2912) ou d'autres couches sus-jacentes (2903) présentant des caractéristiques transparentes, partiellement transparentes ou opaques ou bien une combinaison de toutes ces caractéristiques. L'invention a trait à des procédés destinés à la fabrication de puces encapsulées. L'invention porte aussi sur des structures de puces à couvercle (2901) et des ensembles (3031) comprenant des puces à couvercle.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | STRUCTURE AND METHOD OF MAKING LIDDED CHIPS |
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