ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING
A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the to...
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| creator | DIAO, JIE WANG, YOU JIA, RENHE YILMAZ, ALPAY TSAI, STAN, D KARUPPIAH, LAKSH |
| description | A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
L'invention concerne un procédé de conditionnement d'un tampon Ecmp. Dans un mode de réalisation, un procédé de traitement électrochimique d'un substrat consiste à utiliser une tension de polarisation électrique entre la surface supérieure de l'ensemble tampon et une électrode, et à éliminer de manière électrochimique les agents contaminants de la surface supérieure du tampon. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2007094869A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2007094869A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2007094869A33</originalsourceid><addsrcrecordid>eNrjZLBy9XF1Dgnyd_Zw9fV0dvRR8HUN8fB3UXDzD1JwdfYNUAjw9_EM9vD0c1cIcHRRcPb3c_EM8fT3AwrwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jAwNzA0sTCzNLR2Nj4lQBAFdDKgc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING</title><source>esp@cenet</source><creator>DIAO, JIE ; WANG, YOU ; JIA, RENHE ; YILMAZ, ALPAY ; TSAI, STAN, D ; KARUPPIAH, LAKSH</creator><creatorcontrib>DIAO, JIE ; WANG, YOU ; JIA, RENHE ; YILMAZ, ALPAY ; TSAI, STAN, D ; KARUPPIAH, LAKSH</creatorcontrib><description>A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
L'invention concerne un procédé de conditionnement d'un tampon Ecmp. Dans un mode de réalisation, un procédé de traitement électrochimique d'un substrat consiste à utiliser une tension de polarisation électrique entre la surface supérieure de l'ensemble tampon et une électrode, et à éliminer de manière électrochimique les agents contaminants de la surface supérieure du tampon.</description><language>eng ; fre</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINE TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; POLISHING ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS ; SEMICONDUCTOR DEVICES ; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL ; TRANSPORTING ; WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081002&DB=EPODOC&CC=WO&NR=2007094869A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081002&DB=EPODOC&CC=WO&NR=2007094869A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DIAO, JIE</creatorcontrib><creatorcontrib>WANG, YOU</creatorcontrib><creatorcontrib>JIA, RENHE</creatorcontrib><creatorcontrib>YILMAZ, ALPAY</creatorcontrib><creatorcontrib>TSAI, STAN, D</creatorcontrib><creatorcontrib>KARUPPIAH, LAKSH</creatorcontrib><title>ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING</title><description>A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
L'invention concerne un procédé de conditionnement d'un tampon Ecmp. Dans un mode de réalisation, un procédé de traitement électrochimique d'un substrat consiste à utiliser une tension de polarisation électrique entre la surface supérieure de l'ensemble tampon et une électrode, et à éliminer de manière électrochimique les agents contaminants de la surface supérieure du tampon.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINE TOOLS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL</subject><subject>TRANSPORTING</subject><subject>WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBy9XF1Dgnyd_Zw9fV0dvRR8HUN8fB3UXDzD1JwdfYNUAjw9_EM9vD0c1cIcHRRcPb3c_EM8fT3AwrwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jAwNzA0sTCzNLR2Nj4lQBAFdDKgc</recordid><startdate>20081002</startdate><enddate>20081002</enddate><creator>DIAO, JIE</creator><creator>WANG, YOU</creator><creator>JIA, RENHE</creator><creator>YILMAZ, ALPAY</creator><creator>TSAI, STAN, D</creator><creator>KARUPPIAH, LAKSH</creator><scope>EVB</scope></search><sort><creationdate>20081002</creationdate><title>ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING</title><author>DIAO, JIE ; WANG, YOU ; JIA, RENHE ; YILMAZ, ALPAY ; TSAI, STAN, D ; KARUPPIAH, LAKSH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2007094869A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2008</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINE TOOLS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL</topic><topic>TRANSPORTING</topic><topic>WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</topic><toplevel>online_resources</toplevel><creatorcontrib>DIAO, JIE</creatorcontrib><creatorcontrib>WANG, YOU</creatorcontrib><creatorcontrib>JIA, RENHE</creatorcontrib><creatorcontrib>YILMAZ, ALPAY</creatorcontrib><creatorcontrib>TSAI, STAN, D</creatorcontrib><creatorcontrib>KARUPPIAH, LAKSH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DIAO, JIE</au><au>WANG, YOU</au><au>JIA, RENHE</au><au>YILMAZ, ALPAY</au><au>TSAI, STAN, D</au><au>KARUPPIAH, LAKSH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING</title><date>2008-10-02</date><risdate>2008</risdate><abstract>A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
L'invention concerne un procédé de conditionnement d'un tampon Ecmp. Dans un mode de réalisation, un procédé de traitement électrochimique d'un substrat consiste à utiliser une tension de polarisation électrique entre la surface supérieure de l'ensemble tampon et une électrode, et à éliminer de manière électrochimique les agents contaminants de la surface supérieure du tampon.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POLISHING PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL TRANSPORTING WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL |
| title | ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING |
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