SILICON CARRIER HAVING INCREASED FLEXIBILITY

An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage. L'invention co...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	WEBB, BUCKNELL, CHAPMAN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	WEBB, BUCKNELL, CHAPMAN
description	An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage. L'invention concerne un dispositif et un procédé destinés à conférer une souplesse accrue à un support de puces de silicium, et faisant intervenir, dans au moins un mode de réalisation, de multiples puces et un support de puces de silicium présentant des régions amincies entre certaines puces adjacentes, ce qui permet d'obtenir une souplesse accrue et une déformation de boîtier réduite.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2007077109A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2007077109A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2007077109A33</originalsourceid><addsrcrecordid>eNrjZNAJ9vTxdPb3U3B2DArydA1S8HAM8_RzV_D0cw5ydQx2dVFw83GN8HQCqgqJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYG5gbm5oYGlo7GxsSpAgAzHyYy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SILICON CARRIER HAVING INCREASED FLEXIBILITY</title><source>esp@cenet</source><creator>WEBB, BUCKNELL, CHAPMAN</creator><creatorcontrib>WEBB, BUCKNELL, CHAPMAN</creatorcontrib><description>An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage. L'invention concerne un dispositif et un procédé destinés à conférer une souplesse accrue à un support de puces de silicium, et faisant intervenir, dans au moins un mode de réalisation, de multiples puces et un support de puces de silicium présentant des régions amincies entre certaines puces adjacentes, ce qui permet d'obtenir une souplesse accrue et une déformation de boîtier réduite.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070830&DB=EPODOC&CC=WO&NR=2007077109A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070830&DB=EPODOC&CC=WO&NR=2007077109A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEBB, BUCKNELL, CHAPMAN</creatorcontrib><title>SILICON CARRIER HAVING INCREASED FLEXIBILITY</title><description>An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage. L'invention concerne un dispositif et un procédé destinés à conférer une souplesse accrue à un support de puces de silicium, et faisant intervenir, dans au moins un mode de réalisation, de multiples puces et un support de puces de silicium présentant des régions amincies entre certaines puces adjacentes, ce qui permet d'obtenir une souplesse accrue et une déformation de boîtier réduite.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJ9vTxdPb3U3B2DArydA1S8HAM8_RzV_D0cw5ydQx2dVFw83GN8HQCqgqJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYG5gbm5oYGlo7GxsSpAgAzHyYy</recordid><startdate>20070830</startdate><enddate>20070830</enddate><creator>WEBB, BUCKNELL, CHAPMAN</creator><scope>EVB</scope></search><sort><creationdate>20070830</creationdate><title>SILICON CARRIER HAVING INCREASED FLEXIBILITY</title><author>WEBB, BUCKNELL, CHAPMAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2007077109A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WEBB, BUCKNELL, CHAPMAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEBB, BUCKNELL, CHAPMAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILICON CARRIER HAVING INCREASED FLEXIBILITY</title><date>2007-08-30</date><risdate>2007</risdate><abstract>An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage. L'invention concerne un dispositif et un procédé destinés à conférer une souplesse accrue à un support de puces de silicium, et faisant intervenir, dans au moins un mode de réalisation, de multiples puces et un support de puces de silicium présentant des régions amincies entre certaines puces adjacentes, ce qui permet d'obtenir une souplesse accrue et une déformation de boîtier réduite.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre
recordid	cdi_epo_espacenet_WO2007077109A3
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SILICON CARRIER HAVING INCREASED FLEXIBILITY
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T05%3A43%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WEBB,%20BUCKNELL,%20CHAPMAN&rft.date=2007-08-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2007077109A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true