3D MMIC BALUN AND METHODS OF MAKING THE SAME

A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric...

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Bibliographische Detailangaben
Hauptverfasser: LAN, XING, KINTIS, MARK, FONG, FLAVIA, S
Format: Patent
Sprache:eng ; fre
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