FLEXIBLE SUBSTRATE AND METHOD OF MANUFACTURE

A flexible substrate for a flexible circuit provided by a substrate having a thickness in the range of 25 microns to 60 microns including at least one zone where the thickness of said substrate is reduced to less than 25 microns. The reduced thickness zone may be defined by laser skiving. Substrat f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, YONG PENG, TRUONG, THACH, G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!