SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS

Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer. L'invention concerne des systèmes et d...

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1. Verfasser: PHAM, XUYEN
Format: Patent
Sprache:eng ; fre
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