SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS
Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer. L'invention concerne des systèmes et d...
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| creator | PHAM, XUYEN |
| description | Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
L'invention concerne des systèmes et des procédés, qui permettent de traiter une première et une seconde faces d'une plaquette. Le système comprend une plate-forme adaptée pour recevoir et mettre en rotation la plaquette; et une première et une seconde têtes reliées à la plate-forme pour accéder auxdites première et seconde faces de la plaquette. |
| format | Patent |
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L'invention concerne des systèmes et des procédés, qui permettent de traiter une première et une seconde faces d'une plaquette. Le système comprend une plate-forme adaptée pour recevoir et mettre en rotation la plaquette; et une première et une seconde têtes reliées à la plate-forme pour accéder auxdites première et seconde faces de la plaquette.</description><language>eng ; fre</language><subject>CLEANING ; CLEANING IN GENERAL ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060727&DB=EPODOC&CC=WO&NR=2006078357A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060727&DB=EPODOC&CC=WO&NR=2006078357A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PHAM, XUYEN</creatorcontrib><title>SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS</title><description>Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
L'invention concerne des systèmes et des procédés, qui permettent de traiter une première et une seconde faces d'une plaquette. Le système comprend une plate-forme adaptée pour recevoir et mettre en rotation la plaquette; et une première et une seconde têtes reliées à la plate-forme pour accéder auxdites première et seconde faces de la plaquette.</description><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOjgwOcfVVcPRzUfB1DfHwd1Fw8w9SCA7w9PPz9HNXCHb19XT293MJdQ4BCoc7urkGBfMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDAzMDcwtjU3NHI2PiVAEAUXkoRQ</recordid><startdate>20060727</startdate><enddate>20060727</enddate><creator>PHAM, XUYEN</creator><scope>EVB</scope></search><sort><creationdate>20060727</creationdate><title>SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS</title><author>PHAM, XUYEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2006078357A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2006</creationdate><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>PHAM, XUYEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PHAM, XUYEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS</title><date>2006-07-27</date><risdate>2006</risdate><abstract>Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
L'invention concerne des systèmes et des procédés, qui permettent de traiter une première et une seconde faces d'une plaquette. Le système comprend une plate-forme adaptée pour recevoir et mettre en rotation la plaquette; et une première et une seconde têtes reliées à la plate-forme pour accéder auxdites première et seconde faces de la plaquette.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2006078357A2 |
| source | esp@cenet |
| subjects | CLEANING CLEANING IN GENERAL PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL TRANSPORTING |
| title | SYSTEM AND METHOD FOR SPINNING SEMICONDUCTOR WAFERS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T18%3A18%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PHAM,%20XUYEN&rft.date=2006-07-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2006078357A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |