ASSEMBLY AND METHOD OF PLACING THE ASSEMBLY ON AN EXTERNAL BOARD

The assembly comprises an electronic device (20) that is attached to a first side (11) of a carrier substrate (10) with solder connections (18). The first side (11) of the substrate (10) is provided with bond pads (15) and a solder resist layer (16). The space between the substrate (10) and the elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VAN DEN BOOMEN, RENE, W., J., M, VAN KLEEF, MARCUS, H
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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