COOLING DEVICES AND METHODS OF USING THEM
A method and device for cooling an electronic component 1810 during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body 1710 optionally with one or more voids 1730. In certain examples, a cooling medium that can receive, absords or...
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| creator | SLIM, SIMAN RAE, ALAN ABYS, JOE SINGH, BAWA LEWIS, BRIAN GULINO, ANGELO, J HOLTZER, MITCH VARNELL, WILLIAM, D |
| description | A method and device for cooling an electronic component 1810 during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body 1710 optionally with one or more voids 1730. In certain examples, a cooling medium that can receive, absords or extract heat from the electronic component 1810 and/or the surrounding environment is disposed on or in the cooling device body 1710. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape 1820 disposed on the polymeric cooling device body, is disclosed.
La présente invention a trait à un dispositif pour le refroidissement d'un composant électronique lors de sa fabrication, réparation, ou remise en état. Dans certains modes de réalisation, le dispositif de refroidissement comporte un corps de refroidissement avec un ou des vides. Dans certains modes de réalisation, le dispositif de refroidissement qui peut recevoir, absorber ou extraire de la chaleur depuis le composant électronique et/ou le milieu ambiant, est disposé sur ou dans le corps du dispositif de refroidissement. Dans certains modes de réalisation, un dispositif de refroidissement est décrit comportant un corps de dispositif de refroidissement polymérique, éventuellement avec une bande disposée sur le corps de refroidissement polymérique. |
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La présente invention a trait à un dispositif pour le refroidissement d'un composant électronique lors de sa fabrication, réparation, ou remise en état. Dans certains modes de réalisation, le dispositif de refroidissement comporte un corps de refroidissement avec un ou des vides. Dans certains modes de réalisation, le dispositif de refroidissement qui peut recevoir, absorber ou extraire de la chaleur depuis le composant électronique et/ou le milieu ambiant, est disposé sur ou dans le corps du dispositif de refroidissement. Dans certains modes de réalisation, un dispositif de refroidissement est décrit comportant un corps de dispositif de refroidissement polymérique, éventuellement avec une bande disposée sur le corps de refroidissement polymérique.</description><edition>7</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; MECHANICAL ENGINEERING ; PHYSICS ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; SEMICONDUCTOR DEVICES ; TESTING ; WEAPONS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060518&DB=EPODOC&CC=WO&NR=2005070163A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060518&DB=EPODOC&CC=WO&NR=2005070163A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SLIM, SIMAN</creatorcontrib><creatorcontrib>RAE, ALAN</creatorcontrib><creatorcontrib>ABYS, JOE</creatorcontrib><creatorcontrib>SINGH, BAWA</creatorcontrib><creatorcontrib>LEWIS, BRIAN</creatorcontrib><creatorcontrib>GULINO, ANGELO, J</creatorcontrib><creatorcontrib>HOLTZER, MITCH</creatorcontrib><creatorcontrib>VARNELL, WILLIAM, D</creatorcontrib><title>COOLING DEVICES AND METHODS OF USING THEM</title><description>A method and device for cooling an electronic component 1810 during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body 1710 optionally with one or more voids 1730. In certain examples, a cooling medium that can receive, absords or extract heat from the electronic component 1810 and/or the surrounding environment is disposed on or in the cooling device body 1710. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape 1820 disposed on the polymeric cooling device body, is disclosed.
La présente invention a trait à un dispositif pour le refroidissement d'un composant électronique lors de sa fabrication, réparation, ou remise en état. Dans certains modes de réalisation, le dispositif de refroidissement comporte un corps de refroidissement avec un ou des vides. Dans certains modes de réalisation, le dispositif de refroidissement qui peut recevoir, absorber ou extraire de la chaleur depuis le composant électronique et/ou le milieu ambiant, est disposé sur ou dans le corps du dispositif de refroidissement. Dans certains modes de réalisation, un dispositif de refroidissement est décrit comportant un corps de dispositif de refroidissement polymérique, éventuellement avec une bande disposée sur le corps de refroidissement polymérique.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB09vf38fRzV3BxDfN0dg1WcPRzUfB1DfHwdwlW8HdTCA0GSYZ4uPryMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL4cH8jAwNTA3MDQzNjR2Nj4lQBAJwMJPI</recordid><startdate>20060518</startdate><enddate>20060518</enddate><creator>SLIM, SIMAN</creator><creator>RAE, ALAN</creator><creator>ABYS, JOE</creator><creator>SINGH, BAWA</creator><creator>LEWIS, BRIAN</creator><creator>GULINO, ANGELO, J</creator><creator>HOLTZER, MITCH</creator><creator>VARNELL, WILLIAM, D</creator><scope>EVB</scope></search><sort><creationdate>20060518</creationdate><title>COOLING DEVICES AND METHODS OF USING THEM</title><author>SLIM, SIMAN ; RAE, ALAN ; ABYS, JOE ; SINGH, BAWA ; LEWIS, BRIAN ; GULINO, ANGELO, J ; HOLTZER, MITCH ; VARNELL, WILLIAM, D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2005070163A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SLIM, SIMAN</creatorcontrib><creatorcontrib>RAE, ALAN</creatorcontrib><creatorcontrib>ABYS, JOE</creatorcontrib><creatorcontrib>SINGH, BAWA</creatorcontrib><creatorcontrib>LEWIS, BRIAN</creatorcontrib><creatorcontrib>GULINO, ANGELO, J</creatorcontrib><creatorcontrib>HOLTZER, MITCH</creatorcontrib><creatorcontrib>VARNELL, WILLIAM, D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SLIM, SIMAN</au><au>RAE, ALAN</au><au>ABYS, JOE</au><au>SINGH, BAWA</au><au>LEWIS, BRIAN</au><au>GULINO, ANGELO, J</au><au>HOLTZER, MITCH</au><au>VARNELL, WILLIAM, D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICES AND METHODS OF USING THEM</title><date>2006-05-18</date><risdate>2006</risdate><abstract>A method and device for cooling an electronic component 1810 during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body 1710 optionally with one or more voids 1730. In certain examples, a cooling medium that can receive, absords or extract heat from the electronic component 1810 and/or the surrounding environment is disposed on or in the cooling device body 1710. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape 1820 disposed on the polymeric cooling device body, is disclosed.
La présente invention a trait à un dispositif pour le refroidissement d'un composant électronique lors de sa fabrication, réparation, ou remise en état. Dans certains modes de réalisation, le dispositif de refroidissement comporte un corps de refroidissement avec un ou des vides. Dans certains modes de réalisation, le dispositif de refroidissement qui peut recevoir, absorber ou extraire de la chaleur depuis le composant électronique et/ou le milieu ambiant, est disposé sur ou dans le corps du dispositif de refroidissement. Dans certains modes de réalisation, un dispositif de refroidissement est décrit comportant un corps de dispositif de refroidissement polymérique, éventuellement avec une bande disposée sur le corps de refroidissement polymérique.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MECHANICAL ENGINEERING PHYSICS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES TESTING WEAPONS |
| title | COOLING DEVICES AND METHODS OF USING THEM |
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