CHIP SCALE PACKAGE AND METHOD OF ASSEMBLING THE SAME
A method of producing a chip scale package is disclosed. The method includes dicing a wafer into a plurality of chip arrays, each array including two or more integrated circuit chips. The method further includes mounting each array on a substrate and dicing each array, attached to the substrate, int...
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| creator | KOLAN, RAVI KANTH WANG, CHUEN KHIANG TAN, HIEN BOON CHONG, DESMOND YOK RUE BIDIN, RAHAMAT SUN, ANTHONY YI SHENG |
| description | A method of producing a chip scale package is disclosed. The method includes dicing a wafer into a plurality of chip arrays, each array including two or more integrated circuit chips. The method further includes mounting each array on a substrate and dicing each array, attached to the substrate, into individual chip scale packages, each individual chip scale package including only one integrated circuit chip.
Procédé de fabrication d'un boîtier à l'échelle d'une puce. Ce procédé consiste à découper une tranche en plusieurs matrices de puce dont chacune comprend au moins deux puces à circuit intégré. Ledit procédé consiste également à monter chaque matrice sur un substrat et à découper chaque matrice, fixée au substrat, de manière à obtenir des boîtiers individuels à l'échelle d'une puce, chacun de ces boîtiers comprenant une seule puce à circuit intégré. |
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Procédé de fabrication d'un boîtier à l'échelle d'une puce. Ce procédé consiste à découper une tranche en plusieurs matrices de puce dont chacune comprend au moins deux puces à circuit intégré. Ledit procédé consiste également à monter chaque matrice sur un substrat et à découper chaque matrice, fixée au substrat, de manière à obtenir des boîtiers individuels à l'échelle d'une puce, chacun de ces boîtiers comprenant une seule puce à circuit intégré.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071221&DB=EPODOC&CC=WO&NR=2005053373A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071221&DB=EPODOC&CC=WO&NR=2005053373A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOLAN, RAVI KANTH</creatorcontrib><creatorcontrib>WANG, CHUEN KHIANG</creatorcontrib><creatorcontrib>TAN, HIEN BOON</creatorcontrib><creatorcontrib>CHONG, DESMOND YOK RUE</creatorcontrib><creatorcontrib>BIDIN, RAHAMAT</creatorcontrib><creatorcontrib>SUN, ANTHONY YI SHENG</creatorcontrib><title>CHIP SCALE PACKAGE AND METHOD OF ASSEMBLING THE SAME</title><description>A method of producing a chip scale package is disclosed. The method includes dicing a wafer into a plurality of chip arrays, each array including two or more integrated circuit chips. The method further includes mounting each array on a substrate and dicing each array, attached to the substrate, into individual chip scale packages, each individual chip scale package including only one integrated circuit chip.
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Procédé de fabrication d'un boîtier à l'échelle d'une puce. Ce procédé consiste à découper une tranche en plusieurs matrices de puce dont chacune comprend au moins deux puces à circuit intégré. Ledit procédé consiste également à monter chaque matrice sur un substrat et à découper chaque matrice, fixée au substrat, de manière à obtenir des boîtiers individuels à l'échelle d'une puce, chacun de ces boîtiers comprenant une seule puce à circuit intégré.</abstract><oa>free_for_read</oa></addata></record> |
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| title | CHIP SCALE PACKAGE AND METHOD OF ASSEMBLING THE SAME |
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