SYSTEM AND METHOD FOR FEEDFORWARD CONTROL IN THIN FILM COATING PROCESSES
A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering process is combined with a feedforward control system to improve system performance. The control system...
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| creator | MARK, GEORGE EVAN, CRAVES |
| description | A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering process is combined with a feedforward control system to improve system performance. The control system enables much faster stabilization of the reactive sputtering process during target start-up, and improves control of the process once a steady-state operating condition has been reached following target start-up.
L'invention concerne un système et un procédé de commande prédictive dans des processus de dépôt de revêtement en couches minces. Un système d'asservissement PID classique qui surveille en continu au moins deux variables de traitement dans un processus de pulvérisation réactive est combiné à un système de commande prédictive afin d'améliorer le rendement du système. Le système de commande permet une stabilisation plus rapide du processus de pulvérisation réactive lors du démarrage d'une cible et améliore la commande du processus une fois une condition de fonctionnement en régime permanent atteinte après le démarrage d'une cible. |
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L'invention concerne un système et un procédé de commande prédictive dans des processus de dépôt de revêtement en couches minces. Un système d'asservissement PID classique qui surveille en continu au moins deux variables de traitement dans un processus de pulvérisation réactive est combiné à un système de commande prédictive afin d'améliorer le rendement du système. Le système de commande permet une stabilisation plus rapide du processus de pulvérisation réactive lors du démarrage d'une cible et améliore la commande du processus une fois une condition de fonctionnement en régime permanent atteinte après le démarrage d'une cible.</description><edition>7</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050421&DB=EPODOC&CC=WO&NR=2005036607A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050421&DB=EPODOC&CC=WO&NR=2005036607A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARK, GEORGE</creatorcontrib><creatorcontrib>EVAN, CRAVES</creatorcontrib><title>SYSTEM AND METHOD FOR FEEDFORWARD CONTROL IN THIN FILM COATING PROCESSES</title><description>A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering process is combined with a feedforward control system to improve system performance. The control system enables much faster stabilization of the reactive sputtering process during target start-up, and improves control of the process once a steady-state operating condition has been reached following target start-up.
L'invention concerne un système et un procédé de commande prédictive dans des processus de dépôt de revêtement en couches minces. Un système d'asservissement PID classique qui surveille en continu au moins deux variables de traitement dans un processus de pulvérisation réactive est combiné à un système de commande prédictive afin d'améliorer le rendement du système. Le système de commande permet une stabilisation plus rapide du processus de pulvérisation réactive lors du démarrage d'une cible et améliore la commande du processus une fois une condition de fonctionnement en régime permanent atteinte après le démarrage d'une cible.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAIjgwOcfVVcPRzUfB1DfHwd1Fw8w9ScHN1dQHS4Y5BLgrO_n4hQf4-Cp5-CiEeQMLN08cXKOgY4unnrhAQ5O_sGhzsGszDwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-LD_Y0MDEwNjM3MDMwdjYyJUwUAr6Qtsw</recordid><startdate>20050421</startdate><enddate>20050421</enddate><creator>MARK, GEORGE</creator><creator>EVAN, CRAVES</creator><scope>EVB</scope></search><sort><creationdate>20050421</creationdate><title>SYSTEM AND METHOD FOR FEEDFORWARD CONTROL IN THIN FILM COATING PROCESSES</title><author>MARK, GEORGE ; EVAN, CRAVES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2005036607A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MARK, GEORGE</creatorcontrib><creatorcontrib>EVAN, CRAVES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARK, GEORGE</au><au>EVAN, CRAVES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR FEEDFORWARD CONTROL IN THIN FILM COATING PROCESSES</title><date>2005-04-21</date><risdate>2005</risdate><abstract>A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering process is combined with a feedforward control system to improve system performance. The control system enables much faster stabilization of the reactive sputtering process during target start-up, and improves control of the process once a steady-state operating condition has been reached following target start-up.
L'invention concerne un système et un procédé de commande prédictive dans des processus de dépôt de revêtement en couches minces. Un système d'asservissement PID classique qui surveille en continu au moins deux variables de traitement dans un processus de pulvérisation réactive est combiné à un système de commande prédictive afin d'améliorer le rendement du système. Le système de commande permet une stabilisation plus rapide du processus de pulvérisation réactive lors du démarrage d'une cible et améliore la commande du processus une fois une condition de fonctionnement en régime permanent atteinte après le démarrage d'une cible.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SYSTEM AND METHOD FOR FEEDFORWARD CONTROL IN THIN FILM COATING PROCESSES |
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