CAPILLARY WITH CONTAINED INNER CHAMFER

A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of...

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Hauptverfasser: BRUNNER, JON, MIRONESCU, DAN, AMSALEM, MOSHE, BAHALUL, ARIE, PERLBERG, GIL
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creator BRUNNER, JON
MIRONESCU, DAN
AMSALEM, MOSHE
BAHALUL, ARIE
PERLBERG, GIL
description A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool. L'invention concerne un outil pour connexion permettant de connecter un fil fin à des plots de connexion présentant un pas très fin. L'outil pour connexion comprend une pointe de travail à une extrémité. La pointe de travail comprend un chanfrein annulaire formé au niveau d'une partie intérieure de l'extrémité de la pointe de travail, le chanfrein annulaire intérieur présentant un angle inférieur à environ 60 degrés. Le chanfrein annulaire intérieur est accouplé à une partie inférieure d'un passage cylindrique formé dans l'outil pour connexion.
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subjects BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title CAPILLARY WITH CONTAINED INNER CHAMFER
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