DESICCANT MATRIX COMPOSITION FOR APPLICATION AT RAUM TEMPERATURE
A desiccating matrix composition that includes hydrogen-bonding polymer, plasticizer, organic-modified clay, adsorbent and optionally metal stearate. The hydrogen-bonding polymer is moisture cured at 100m temperature. Composition matricielle desséchante contenant un polymère de liaison avec hydrogèn...
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| creator | NGUYEN-MISRA, MAI, T HOGLUND, HEIDI, J |
| description | A desiccating matrix composition that includes hydrogen-bonding polymer, plasticizer, organic-modified clay, adsorbent and optionally metal stearate. The hydrogen-bonding polymer is moisture cured at 100m temperature.
Composition matricielle desséchante contenant un polymère de liaison avec hydrogène, un plastifiant, une argile organique modifiée, un adsorbant et un stéarate de métal éventuel. Ce polymère de liaison avec hydrogène est durci à l'humidité et à une température de 100 DEG C. |
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Composition matricielle desséchante contenant un polymère de liaison avec hydrogène, un plastifiant, une argile organique modifiée, un adsorbant et un stéarate de métal éventuel. Ce polymère de liaison avec hydrogène est durci à l'humidité et à une température de 100 DEG C.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEPARATION THEIR RELEVANT APPARATUS TRANSPORTING |
| title | DESICCANT MATRIX COMPOSITION FOR APPLICATION AT RAUM TEMPERATURE |
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