PLATING UNIFORMITY CONTROL BY CONTACT RING SHAPING
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality o...
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| creator | ESTEBAN, CELINA, M TRINH, SON, N HERCHEN, HARALD WEBB, TIMOTHY, R HAO, HENAN |
| description | An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
L'invention concerne un appareil conçu pour appliquer une polarisation électrique sur un substrat dans un système de traitement. Ledit appareil comporte généralement un corps annulaire conducteur définissant une ouverture centrale. Ledit corps annulaire conducteur peut posséder une surface portante de substrat conçue pour recevoir le substrat et plusieurs cornes formées sur une surface opposée à la surface portante du substrat. Plusieurs contacts électriques peuvent être formés sur le substrat à l'opposé de plusieurs cornes. Les contacts électriques peuvent être conçus pour venir en contact avec une surface de dépôt du substrat. |
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L'invention concerne un appareil conçu pour appliquer une polarisation électrique sur un substrat dans un système de traitement. Ledit appareil comporte généralement un corps annulaire conducteur définissant une ouverture centrale. Ledit corps annulaire conducteur peut posséder une surface portante de substrat conçue pour recevoir le substrat et plusieurs cornes formées sur une surface opposée à la surface portante du substrat. Plusieurs contacts électriques peuvent être formés sur le substrat à l'opposé de plusieurs cornes. Les contacts électriques peuvent être conçus pour venir en contact avec une surface de dépôt du substrat.</description><edition>7</edition><language>eng ; fre</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040610&DB=EPODOC&CC=WO&NR=2004038072A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040610&DB=EPODOC&CC=WO&NR=2004038072A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ESTEBAN, CELINA, M</creatorcontrib><creatorcontrib>TRINH, SON, N</creatorcontrib><creatorcontrib>HERCHEN, HARALD</creatorcontrib><creatorcontrib>WEBB, TIMOTHY, R</creatorcontrib><creatorcontrib>HAO, HENAN</creatorcontrib><title>PLATING UNIFORMITY CONTROL BY CONTACT RING SHAPING</title><description>An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
L'invention concerne un appareil conçu pour appliquer une polarisation électrique sur un substrat dans un système de traitement. Ledit appareil comporte généralement un corps annulaire conducteur définissant une ouverture centrale. Ledit corps annulaire conducteur peut posséder une surface portante de substrat conçue pour recevoir le substrat et plusieurs cornes formées sur une surface opposée à la surface portante du substrat. Plusieurs contacts électriques peuvent être formés sur le substrat à l'opposé de plusieurs cornes. Les contacts électriques peuvent être conçus pour venir en contact avec une surface de dépôt du substrat.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAK8HEM8fRzVwj183TzD_L1DIlUcPb3Cwny91FwgjAdnUMUgkBKgj0cA4A0DwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JD_c3MjAwMTC2MDA3cjQ2Jk4VAC3-J-g</recordid><startdate>20040610</startdate><enddate>20040610</enddate><creator>ESTEBAN, CELINA, M</creator><creator>TRINH, SON, N</creator><creator>HERCHEN, HARALD</creator><creator>WEBB, TIMOTHY, R</creator><creator>HAO, HENAN</creator><scope>EVB</scope></search><sort><creationdate>20040610</creationdate><title>PLATING UNIFORMITY CONTROL BY CONTACT RING SHAPING</title><author>ESTEBAN, CELINA, M ; TRINH, SON, N ; HERCHEN, HARALD ; WEBB, TIMOTHY, R ; HAO, HENAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2004038072A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2004</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>ESTEBAN, CELINA, M</creatorcontrib><creatorcontrib>TRINH, SON, N</creatorcontrib><creatorcontrib>HERCHEN, HARALD</creatorcontrib><creatorcontrib>WEBB, TIMOTHY, R</creatorcontrib><creatorcontrib>HAO, HENAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ESTEBAN, CELINA, M</au><au>TRINH, SON, N</au><au>HERCHEN, HARALD</au><au>WEBB, TIMOTHY, R</au><au>HAO, HENAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING UNIFORMITY CONTROL BY CONTACT RING SHAPING</title><date>2004-06-10</date><risdate>2004</risdate><abstract>An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
L'invention concerne un appareil conçu pour appliquer une polarisation électrique sur un substrat dans un système de traitement. Ledit appareil comporte généralement un corps annulaire conducteur définissant une ouverture centrale. Ledit corps annulaire conducteur peut posséder une surface portante de substrat conçue pour recevoir le substrat et plusieurs cornes formées sur une surface opposée à la surface portante du substrat. Plusieurs contacts électriques peuvent être formés sur le substrat à l'opposé de plusieurs cornes. Les contacts électriques peuvent être conçus pour venir en contact avec une surface de dépôt du substrat.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | PLATING UNIFORMITY CONTROL BY CONTACT RING SHAPING |
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