PRINTED CIRCUIT BOARD WITH ISOLATED METALLIC SUBSTRATE COMPRISING AN INTEGRATED COOLING SYSTEM

The invention relates to a board comprising a metallic substrate (10), at least one electrically-isolating layer (11), which is stuck to the metallic substrate (10), and electroconductive tracks (12) which can be used to interconnect electronic power components (24) and which are stuck to the electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BORREGO BEL, CARLES, SUBIRATS SOLE, ALEX, SANCHEZ FOGUET, XAVIER
Format:	Patent
Sprache:	eng ; fre ; spa
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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