SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SCHWEITZER, CHARLES, FREDERICK MILLER, MARK, D FUKS, STEPHEN, EDWARD KRAUTHEIM, THOMAS, B FOSTER, RAYMOND, ERIC BULLOCK, LAWRENCE, LERNEL SINKUNAS, PETER, JOSEPH GOENKA, LAKHI, NANDLAL |
| description | A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé de refusion de pâte à souder pour interconnecter une pluralité de composants électroniques (24) sur un substrat (12). Le système comprend un four de préchauffage du substrat (12) et de la pluralité de composants électroniques (24) disposés sur celui-ci, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire afin de refusionner la pâte à souder (72), une palette (14) destinée à porter le substrat (12), la palette (14) présente au moins une cavité interne (40), et un matériau (42) à transition de phase disposé à l'intérieur de la cavité (40) pour absorber la chaleur de la palette (14). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO0228584A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO0228584A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO0228584A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w_2AoFWha5pebKC5k9yV6lSKxEm0UP8fFz_A6S1vaaLcRDGCpRoiasM1eE4QuSMNdAZs0WliCg4cxwsTkgowKYNv8RqqFkG6SjRZRVmbxWN8znnzc2XAo7pmm6f3kOdpvOdX_gw974qiPJVHuz_8Ub7HBC5y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><source>esp@cenet</source><creator>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; FUKS, STEPHEN, EDWARD ; KRAUTHEIM, THOMAS, B ; FOSTER, RAYMOND, ERIC ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, NANDLAL</creator><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; FUKS, STEPHEN, EDWARD ; KRAUTHEIM, THOMAS, B ; FOSTER, RAYMOND, ERIC ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, NANDLAL</creatorcontrib><description>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé de refusion de pâte à souder pour interconnecter une pluralité de composants électroniques (24) sur un substrat (12). Le système comprend un four de préchauffage du substrat (12) et de la pluralité de composants électroniques (24) disposés sur celui-ci, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire afin de refusionner la pâte à souder (72), une palette (14) destinée à porter le substrat (12), la palette (14) présente au moins une cavité interne (40), et un matériau (42) à transition de phase disposé à l'intérieur de la cavité (40) pour absorber la chaleur de la palette (14).</description><edition>7</edition><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020411&DB=EPODOC&CC=WO&NR=0228584A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020411&DB=EPODOC&CC=WO&NR=0228584A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK</creatorcontrib><creatorcontrib>MILLER, MARK, D</creatorcontrib><creatorcontrib>FUKS, STEPHEN, EDWARD</creatorcontrib><creatorcontrib>KRAUTHEIM, THOMAS, B</creatorcontrib><creatorcontrib>FOSTER, RAYMOND, ERIC</creatorcontrib><creatorcontrib>BULLOCK, LAWRENCE, LERNEL</creatorcontrib><creatorcontrib>SINKUNAS, PETER, JOSEPH</creatorcontrib><creatorcontrib>GOENKA, LAKHI, NANDLAL</creatorcontrib><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><description>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé de refusion de pâte à souder pour interconnecter une pluralité de composants électroniques (24) sur un substrat (12). Le système comprend un four de préchauffage du substrat (12) et de la pluralité de composants électroniques (24) disposés sur celui-ci, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire afin de refusionner la pâte à souder (72), une palette (14) destinée à porter le substrat (12), la palette (14) présente au moins une cavité interne (40), et un matériau (42) à transition de phase disposé à l'intérieur de la cavité (40) pour absorber la chaleur de la palette (14).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_2AoFWha5pebKC5k9yV6lSKxEm0UP8fFz_A6S1vaaLcRDGCpRoiasM1eE4QuSMNdAZs0WliCg4cxwsTkgowKYNv8RqqFkG6SjRZRVmbxWN8znnzc2XAo7pmm6f3kOdpvOdX_gw974qiPJVHuz_8Ub7HBC5y</recordid><startdate>20020411</startdate><enddate>20020411</enddate><creator>SCHWEITZER, CHARLES, FREDERICK</creator><creator>MILLER, MARK, D</creator><creator>FUKS, STEPHEN, EDWARD</creator><creator>KRAUTHEIM, THOMAS, B</creator><creator>FOSTER, RAYMOND, ERIC</creator><creator>BULLOCK, LAWRENCE, LERNEL</creator><creator>SINKUNAS, PETER, JOSEPH</creator><creator>GOENKA, LAKHI, NANDLAL</creator><scope>EVB</scope></search><sort><creationdate>20020411</creationdate><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><author>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; FUKS, STEPHEN, EDWARD ; KRAUTHEIM, THOMAS, B ; FOSTER, RAYMOND, ERIC ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, NANDLAL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO0228584A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2002</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK</creatorcontrib><creatorcontrib>MILLER, MARK, D</creatorcontrib><creatorcontrib>FUKS, STEPHEN, EDWARD</creatorcontrib><creatorcontrib>KRAUTHEIM, THOMAS, B</creatorcontrib><creatorcontrib>FOSTER, RAYMOND, ERIC</creatorcontrib><creatorcontrib>BULLOCK, LAWRENCE, LERNEL</creatorcontrib><creatorcontrib>SINKUNAS, PETER, JOSEPH</creatorcontrib><creatorcontrib>GOENKA, LAKHI, NANDLAL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHWEITZER, CHARLES, FREDERICK</au><au>MILLER, MARK, D</au><au>FUKS, STEPHEN, EDWARD</au><au>KRAUTHEIM, THOMAS, B</au><au>FOSTER, RAYMOND, ERIC</au><au>BULLOCK, LAWRENCE, LERNEL</au><au>SINKUNAS, PETER, JOSEPH</au><au>GOENKA, LAKHI, NANDLAL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><date>2002-04-11</date><risdate>2002</risdate><abstract>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé de refusion de pâte à souder pour interconnecter une pluralité de composants électroniques (24) sur un substrat (12). Le système comprend un four de préchauffage du substrat (12) et de la pluralité de composants électroniques (24) disposés sur celui-ci, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire afin de refusionner la pâte à souder (72), une palette (14) destinée à porter le substrat (12), la palette (14) présente au moins une cavité interne (40), et un matériau (42) à transition de phase disposé à l'intérieur de la cavité (40) pour absorber la chaleur de la palette (14).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO0228584A1 |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T00%3A25%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHWEITZER,%20CHARLES,%20FREDERICK&rft.date=2002-04-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO0228584A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |