SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in...
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| creator | SCHWEITZER, CHARLES, FREDERICK MILLER, MARK, D CHILES, KAREN, LEE BAKER, JAY, DEAVIS ACHARI, ACHYUTA BULLOCK, LAWRENCE, LERNEL SINKUNAS, PETER, JOSEPH GOENKA, LAKHI, N |
| description | A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé utilisés dans la refusion de soudure pour interconnecter une pluralité de composants électroniques (24) à un substrat (12). Ce système comprend un four servant à préchauffer le substrat (12) ainsi que la pluralité de composants électroniques (24) montés sur sa surface, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire et refondre la soudure (72), et une plaque (14) pour soutenir le substrat (12), cette plaque (14) comportant au moins une cavité interne (40), et un matériau de transition de phase (42) logé dans la cavité (40) pour absorber la chaleur émanant de la plaque (14). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO0228583A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO0228583A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO0228583A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w_2AoC1C1zS92EJyJ7kr1akUiZNoof4_Ln6A01ve2kS5iWIESw1E1JYb8Jwgck_a0RkwoNPE1DlwHC9MSCrApAw-4LWrA4L0tWiyirI1q8f0XPLu58aAR3XtPs_vMS_zdM-v_BkHPhRFdapKeyz_KF_G2S5w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><source>esp@cenet</source><creator>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; CHILES, KAREN, LEE ; BAKER, JAY, DEAVIS ; ACHARI, ACHYUTA ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, N</creator><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; CHILES, KAREN, LEE ; BAKER, JAY, DEAVIS ; ACHARI, ACHYUTA ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, N</creatorcontrib><description>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé utilisés dans la refusion de soudure pour interconnecter une pluralité de composants électroniques (24) à un substrat (12). Ce système comprend un four servant à préchauffer le substrat (12) ainsi que la pluralité de composants électroniques (24) montés sur sa surface, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire et refondre la soudure (72), et une plaque (14) pour soutenir le substrat (12), cette plaque (14) comportant au moins une cavité interne (40), et un matériau de transition de phase (42) logé dans la cavité (40) pour absorber la chaleur émanant de la plaque (14).</description><edition>7</edition><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020411&DB=EPODOC&CC=WO&NR=0228583A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020411&DB=EPODOC&CC=WO&NR=0228583A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK</creatorcontrib><creatorcontrib>MILLER, MARK, D</creatorcontrib><creatorcontrib>CHILES, KAREN, LEE</creatorcontrib><creatorcontrib>BAKER, JAY, DEAVIS</creatorcontrib><creatorcontrib>ACHARI, ACHYUTA</creatorcontrib><creatorcontrib>BULLOCK, LAWRENCE, LERNEL</creatorcontrib><creatorcontrib>SINKUNAS, PETER, JOSEPH</creatorcontrib><creatorcontrib>GOENKA, LAKHI, N</creatorcontrib><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><description>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé utilisés dans la refusion de soudure pour interconnecter une pluralité de composants électroniques (24) à un substrat (12). Ce système comprend un four servant à préchauffer le substrat (12) ainsi que la pluralité de composants électroniques (24) montés sur sa surface, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire et refondre la soudure (72), et une plaque (14) pour soutenir le substrat (12), cette plaque (14) comportant au moins une cavité interne (40), et un matériau de transition de phase (42) logé dans la cavité (40) pour absorber la chaleur émanant de la plaque (14).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_2AoC1C1zS92EJyJ7kr1akUiZNoof4_Ln6A01ve2kS5iWIESw1E1JYb8Jwgck_a0RkwoNPE1DlwHC9MSCrApAw-4LWrA4L0tWiyirI1q8f0XPLu58aAR3XtPs_vMS_zdM-v_BkHPhRFdapKeyz_KF_G2S5w</recordid><startdate>20020411</startdate><enddate>20020411</enddate><creator>SCHWEITZER, CHARLES, FREDERICK</creator><creator>MILLER, MARK, D</creator><creator>CHILES, KAREN, LEE</creator><creator>BAKER, JAY, DEAVIS</creator><creator>ACHARI, ACHYUTA</creator><creator>BULLOCK, LAWRENCE, LERNEL</creator><creator>SINKUNAS, PETER, JOSEPH</creator><creator>GOENKA, LAKHI, N</creator><scope>EVB</scope></search><sort><creationdate>20020411</creationdate><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><author>SCHWEITZER, CHARLES, FREDERICK ; MILLER, MARK, D ; CHILES, KAREN, LEE ; BAKER, JAY, DEAVIS ; ACHARI, ACHYUTA ; BULLOCK, LAWRENCE, LERNEL ; SINKUNAS, PETER, JOSEPH ; GOENKA, LAKHI, N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO0228583A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2002</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHWEITZER, CHARLES, FREDERICK</creatorcontrib><creatorcontrib>MILLER, MARK, D</creatorcontrib><creatorcontrib>CHILES, KAREN, LEE</creatorcontrib><creatorcontrib>BAKER, JAY, DEAVIS</creatorcontrib><creatorcontrib>ACHARI, ACHYUTA</creatorcontrib><creatorcontrib>BULLOCK, LAWRENCE, LERNEL</creatorcontrib><creatorcontrib>SINKUNAS, PETER, JOSEPH</creatorcontrib><creatorcontrib>GOENKA, LAKHI, N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHWEITZER, CHARLES, FREDERICK</au><au>MILLER, MARK, D</au><au>CHILES, KAREN, LEE</au><au>BAKER, JAY, DEAVIS</au><au>ACHARI, ACHYUTA</au><au>BULLOCK, LAWRENCE, LERNEL</au><au>SINKUNAS, PETER, JOSEPH</au><au>GOENKA, LAKHI, N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES</title><date>2002-04-11</date><risdate>2002</risdate><abstract>A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
L'invention concerne un système et un procédé utilisés dans la refusion de soudure pour interconnecter une pluralité de composants électroniques (24) à un substrat (12). Ce système comprend un four servant à préchauffer le substrat (12) ainsi que la pluralité de composants électroniques (24) montés sur sa surface, une source de chaleur supplémentaire disposée dans le four pour fournir une énergie thermique supplémentaire et refondre la soudure (72), et une plaque (14) pour soutenir le substrat (12), cette plaque (14) comportant au moins une cavité interne (40), et un matériau de transition de phase (42) logé dans la cavité (40) pour absorber la chaleur émanant de la plaque (14).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ONTO FLEXIBLE SUBSTRATES |
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