ELECTROLESS SILVER PLATING
This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contain...
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| creator | PALANISAMY, THIRUMALAI KOZLOV, ALEXANDER, S NARASIMHAN, DAVE |
| description | This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances thay may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
L'invention concerne l'argenture sans électrodes d'un substrat, un bain d'argenture aqueux, un procédé permettant de déposer un revêtement d'argent uniforme sur différents substrats au moyen d'une composition d'argenture sans électrodes, et un article argenté formé à partir de ladite composition. Le bain d'argenture ne comprend ni ne génère de substances toxiques ou inflammables, ou des substances pouvant contaminer le revêtement d'argent. Lorsqu'on évite les agents de complexage forts, l'argent virtuellement pur peut précipiter à partir du bain par simple ébullition. L'invention concerne également un bain d'argenture autocatalytique sans électrodes constitué de nitrate d'argent, d'hydroxyde d'ammonium, et d'hydrate d'hydrazine. |
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L'invention concerne l'argenture sans électrodes d'un substrat, un bain d'argenture aqueux, un procédé permettant de déposer un revêtement d'argent uniforme sur différents substrats au moyen d'une composition d'argenture sans électrodes, et un article argenté formé à partir de ladite composition. Le bain d'argenture ne comprend ni ne génère de substances toxiques ou inflammables, ou des substances pouvant contaminer le revêtement d'argent. Lorsqu'on évite les agents de complexage forts, l'argent virtuellement pur peut précipiter à partir du bain par simple ébullition. L'invention concerne également un bain d'argenture autocatalytique sans électrodes constitué de nitrate d'argent, d'hydroxyde d'ammonium, et d'hydrate d'hydrazine.</description><edition>7</edition><language>eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030109&DB=EPODOC&CC=WO&NR=0204700A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030109&DB=EPODOC&CC=WO&NR=0204700A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PALANISAMY, THIRUMALAI</creatorcontrib><creatorcontrib>KOZLOV, ALEXANDER, S</creatorcontrib><creatorcontrib>NARASIMHAN, DAVE</creatorcontrib><title>ELECTROLESS SILVER PLATING</title><description>This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances thay may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
L'invention concerne l'argenture sans électrodes d'un substrat, un bain d'argenture aqueux, un procédé permettant de déposer un revêtement d'argent uniforme sur différents substrats au moyen d'une composition d'argenture sans électrodes, et un article argenté formé à partir de ladite composition. Le bain d'argenture ne comprend ni ne génère de substances toxiques ou inflammables, ou des substances pouvant contaminer le revêtement d'argent. Lorsqu'on évite les agents de complexage forts, l'argent virtuellement pur peut précipiter à partir du bain par simple ébullition. L'invention concerne également un bain d'argenture autocatalytique sans électrodes constitué de nitrate d'argent, d'hydroxyde d'ammonium, et d'hydrate d'hydrazine.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBy9XF1Dgny93ENDlYI9vQJcw1SCPBxDPH0c-dhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfHh_gZGBibmBgaOxsZEKAEACOUgEg</recordid><startdate>20030109</startdate><enddate>20030109</enddate><creator>PALANISAMY, THIRUMALAI</creator><creator>KOZLOV, ALEXANDER, S</creator><creator>NARASIMHAN, DAVE</creator><scope>EVB</scope></search><sort><creationdate>20030109</creationdate><title>ELECTROLESS SILVER PLATING</title><author>PALANISAMY, THIRUMALAI ; KOZLOV, ALEXANDER, S ; NARASIMHAN, DAVE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO0204700A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2003</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>PALANISAMY, THIRUMALAI</creatorcontrib><creatorcontrib>KOZLOV, ALEXANDER, S</creatorcontrib><creatorcontrib>NARASIMHAN, DAVE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PALANISAMY, THIRUMALAI</au><au>KOZLOV, ALEXANDER, S</au><au>NARASIMHAN, DAVE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROLESS SILVER PLATING</title><date>2003-01-09</date><risdate>2003</risdate><abstract>This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances thay may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
L'invention concerne l'argenture sans électrodes d'un substrat, un bain d'argenture aqueux, un procédé permettant de déposer un revêtement d'argent uniforme sur différents substrats au moyen d'une composition d'argenture sans électrodes, et un article argenté formé à partir de ladite composition. Le bain d'argenture ne comprend ni ne génère de substances toxiques ou inflammables, ou des substances pouvant contaminer le revêtement d'argent. Lorsqu'on évite les agents de complexage forts, l'argent virtuellement pur peut précipiter à partir du bain par simple ébullition. L'invention concerne également un bain d'argenture autocatalytique sans électrodes constitué de nitrate d'argent, d'hydroxyde d'ammonium, et d'hydrate d'hydrazine.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | ELECTROLESS SILVER PLATING |
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