METHOD OF, AND APPARATUS FOR, ELECTRO-PLATING A STRUCTURE

The invention relates to techniques for selective electro-plating. Previously electro-plating structures with edges sometime resulted in abrupt changes in electric field. Consequently non-uniform deposition occurred and it was difficult to overcome this. More significantly it is sometimes desired to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CORLESS, ANTHONY, ROBERT, HEDGLEY, RICHARD, LYNN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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