Laser segmented cutting

UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned...

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Bibliographische Detailangaben
Hauptverfasser:	FAHEY KEVIN P, WOLFE MICHAEL J, HARRIS RICHARD S, ZOU LIANNG, O'BRIEN JAMES N, BAIRD BRIAN W, SUN YUNLONG
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS REFRACTORIES SLAG SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF NATURAL STONE WELDING WORKING BY LASER BEAM
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