Wired circuit board having one of the conductive layers disposed in an opening formed in metal supporting board

A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness dire...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Sugimoto, Yuu
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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