Semiconductor device including electromagnetic absorption and shielding

Semiconductor device including electromagnetic absorption and shielding

A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask lay...

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Hauptverfasser: Bai, Ye, Chiu, Chin-Tien, Qian, Kaiyou, Huang, Dacheng
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Bai, Ye
Chiu, Chin-Tien
Qian, Kaiyou
Huang, Dacheng
description A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9947606B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9947606B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9947606B23</originalsourceid><addsrcrecordid>eNqNzE0KwjAQhuFuXIh6h7mAICqVbhV_9tV1iZPPOpDOhCT1_Cp4AFfv5uGdVucWg7CpH7lYIo-XMEiUw-hFe0IAl2SD6xVFmNw9W4pFTMmpp_wUhC-cV5OHCxmLX2cVnY7Xw2WJaB1ydIzPoLu1TbPd1at6v978Qd6CajS_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device including electromagnetic absorption and shielding</title><source>esp@cenet</source><creator>Bai, Ye ; Chiu, Chin-Tien ; Qian, Kaiyou ; Huang, Dacheng</creator><creatorcontrib>Bai, Ye ; Chiu, Chin-Tien ; Qian, Kaiyou ; Huang, Dacheng</creatorcontrib><description>A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180417&amp;DB=EPODOC&amp;CC=US&amp;NR=9947606B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180417&amp;DB=EPODOC&amp;CC=US&amp;NR=9947606B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bai, Ye</creatorcontrib><creatorcontrib>Chiu, Chin-Tien</creatorcontrib><creatorcontrib>Qian, Kaiyou</creatorcontrib><creatorcontrib>Huang, Dacheng</creatorcontrib><title>Semiconductor device including electromagnetic absorption and shielding</title><description>A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzE0KwjAQhuFuXIh6h7mAICqVbhV_9tV1iZPPOpDOhCT1_Cp4AFfv5uGdVucWg7CpH7lYIo-XMEiUw-hFe0IAl2SD6xVFmNw9W4pFTMmpp_wUhC-cV5OHCxmLX2cVnY7Xw2WJaB1ydIzPoLu1TbPd1at6v978Qd6CajS_</recordid><startdate>20180417</startdate><enddate>20180417</enddate><creator>Bai, Ye</creator><creator>Chiu, Chin-Tien</creator><creator>Qian, Kaiyou</creator><creator>Huang, Dacheng</creator><scope>EVB</scope></search><sort><creationdate>20180417</creationdate><title>Semiconductor device including electromagnetic absorption and shielding</title><author>Bai, Ye ; Chiu, Chin-Tien ; Qian, Kaiyou ; Huang, Dacheng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9947606B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Bai, Ye</creatorcontrib><creatorcontrib>Chiu, Chin-Tien</creatorcontrib><creatorcontrib>Qian, Kaiyou</creatorcontrib><creatorcontrib>Huang, Dacheng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bai, Ye</au><au>Chiu, Chin-Tien</au><au>Qian, Kaiyou</au><au>Huang, Dacheng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device including electromagnetic absorption and shielding</title><date>2018-04-17</date><risdate>2018</risdate><abstract>A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device including electromagnetic absorption and shielding
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T19%3A51%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Bai,%20Ye&rft.date=2018-04-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9947606B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true