Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer

Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer

A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting wit...

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Hauptverfasser: Williamson Jaimal Mallory, Gallegos Bernardo, Arroyo Jose Carlos
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Williamson Jaimal Mallory
Gallegos Bernardo
Arroyo Jose Carlos
description A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer
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