Thin film transistor substrate and method for manufacturing the same
A thin film transistor substrate includes: a thin film transistor including: a first insulating film covering a gate electrode; a semiconductor channel layer selectively provided on the first insulating film; a second insulating film provided on the semiconductor channel layer; a first source electr...
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creator | Konomi Takaharu Tsumura Naoki Inoue Kazunori Nagayama Kensuke |
description | A thin film transistor substrate includes: a thin film transistor including: a first insulating film covering a gate electrode; a semiconductor channel layer selectively provided on the first insulating film; a second insulating film provided on the semiconductor channel layer; a first source electrode and a first drain electrode selectively provided on the second insulating film, a second source electrode and a second drain electrode provided on the first source electrode and the first drain electrode, respectively, a third insulating film that covers the second source electrode and the second drain electrode; a third source electrode connected to the semiconductor channel layer via a first contact hole provided through the third insulating film, the second and the first source electrode; a third drain electrode connected to the semiconductor channel layer via a second contact hole provided through the third insulating film, the second drain electrode, and the first drain electrode. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9929186B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9929186B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9929186B23</originalsourceid><addsrcrecordid>eNqNijEOwjAMALN0QJQ_-AMMFKkiKwXETpkrt3VIpMapYuf_dOABTKfT3c7ceh8YXFgiaEaWIJoySBllUyVAniGS-jSD20JELg4nLTnwB9QTCEaqTeVwETr8uDfwuPfd80hrGkhWnIhJh_fL2saeLu21Of-xfAGANDL8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thin film transistor substrate and method for manufacturing the same</title><source>esp@cenet</source><creator>Konomi Takaharu ; Tsumura Naoki ; Inoue Kazunori ; Nagayama Kensuke</creator><creatorcontrib>Konomi Takaharu ; Tsumura Naoki ; Inoue Kazunori ; Nagayama Kensuke</creatorcontrib><description>A thin film transistor substrate includes: a thin film transistor including: a first insulating film covering a gate electrode; a semiconductor channel layer selectively provided on the first insulating film; a second insulating film provided on the semiconductor channel layer; a first source electrode and a first drain electrode selectively provided on the second insulating film, a second source electrode and a second drain electrode provided on the first source electrode and the first drain electrode, respectively, a third insulating film that covers the second source electrode and the second drain electrode; a third source electrode connected to the semiconductor channel layer via a first contact hole provided through the third insulating film, the second and the first source electrode; a third drain electrode connected to the semiconductor channel layer via a second contact hole provided through the third insulating film, the second drain electrode, and the first drain electrode.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180327&DB=EPODOC&CC=US&NR=9929186B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180327&DB=EPODOC&CC=US&NR=9929186B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Konomi Takaharu</creatorcontrib><creatorcontrib>Tsumura Naoki</creatorcontrib><creatorcontrib>Inoue Kazunori</creatorcontrib><creatorcontrib>Nagayama Kensuke</creatorcontrib><title>Thin film transistor substrate and method for manufacturing the same</title><description>A thin film transistor substrate includes: a thin film transistor including: a first insulating film covering a gate electrode; a semiconductor channel layer selectively provided on the first insulating film; a second insulating film provided on the semiconductor channel layer; a first source electrode and a first drain electrode selectively provided on the second insulating film, a second source electrode and a second drain electrode provided on the first source electrode and the first drain electrode, respectively, a third insulating film that covers the second source electrode and the second drain electrode; a third source electrode connected to the semiconductor channel layer via a first contact hole provided through the third insulating film, the second and the first source electrode; a third drain electrode connected to the semiconductor channel layer via a second contact hole provided through the third insulating film, the second drain electrode, and the first drain electrode.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEOwjAMALN0QJQ_-AMMFKkiKwXETpkrt3VIpMapYuf_dOABTKfT3c7ceh8YXFgiaEaWIJoySBllUyVAniGS-jSD20JELg4nLTnwB9QTCEaqTeVwETr8uDfwuPfd80hrGkhWnIhJh_fL2saeLu21Of-xfAGANDL8</recordid><startdate>20180327</startdate><enddate>20180327</enddate><creator>Konomi Takaharu</creator><creator>Tsumura Naoki</creator><creator>Inoue Kazunori</creator><creator>Nagayama Kensuke</creator><scope>EVB</scope></search><sort><creationdate>20180327</creationdate><title>Thin film transistor substrate and method for manufacturing the same</title><author>Konomi Takaharu ; Tsumura Naoki ; Inoue Kazunori ; Nagayama Kensuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9929186B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Konomi Takaharu</creatorcontrib><creatorcontrib>Tsumura Naoki</creatorcontrib><creatorcontrib>Inoue Kazunori</creatorcontrib><creatorcontrib>Nagayama Kensuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Konomi Takaharu</au><au>Tsumura Naoki</au><au>Inoue Kazunori</au><au>Nagayama Kensuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thin film transistor substrate and method for manufacturing the same</title><date>2018-03-27</date><risdate>2018</risdate><abstract>A thin film transistor substrate includes: a thin film transistor including: a first insulating film covering a gate electrode; a semiconductor channel layer selectively provided on the first insulating film; a second insulating film provided on the semiconductor channel layer; a first source electrode and a first drain electrode selectively provided on the second insulating film, a second source electrode and a second drain electrode provided on the first source electrode and the first drain electrode, respectively, a third insulating film that covers the second source electrode and the second drain electrode; a third source electrode connected to the semiconductor channel layer via a first contact hole provided through the third insulating film, the second and the first source electrode; a third drain electrode connected to the semiconductor channel layer via a second contact hole provided through the third insulating film, the second drain electrode, and the first drain electrode.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Thin film transistor substrate and method for manufacturing the same |
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