Multicomponent heat sink with movable fin support portion

A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Megarity, Jr. William M, Remis Luke D, Sellman Gregory D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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