Multicomponent heat sink with movable fin support portion
A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipat...
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| creator | Megarity, Jr. William M Remis Luke D Sellman Gregory D |
| description | A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9917033B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9917033B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9917033B23</originalsourceid><addsrcrecordid>eNrjZLD0Lc0pyUzOzy3Iz0vNK1HISE0sUSjOzMtWKM8syVDIzS9LTMpJVUjLzFMoLi0oyC8qUQARmfl5PAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7UkPjTY0tLQ3MDY2MnImAglAC8qLw4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multicomponent heat sink with movable fin support portion</title><source>esp@cenet</source><creator>Megarity, Jr. William M ; Remis Luke D ; Sellman Gregory D</creator><creatorcontrib>Megarity, Jr. William M ; Remis Luke D ; Sellman Gregory D</creatorcontrib><description>A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180313&DB=EPODOC&CC=US&NR=9917033B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180313&DB=EPODOC&CC=US&NR=9917033B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Megarity, Jr. William M</creatorcontrib><creatorcontrib>Remis Luke D</creatorcontrib><creatorcontrib>Sellman Gregory D</creatorcontrib><title>Multicomponent heat sink with movable fin support portion</title><description>A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0Lc0pyUzOzy3Iz0vNK1HISE0sUSjOzMtWKM8syVDIzS9LTMpJVUjLzFMoLi0oyC8qUQARmfl5PAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7UkPjTY0tLQ3MDY2MnImAglAC8qLw4</recordid><startdate>20180313</startdate><enddate>20180313</enddate><creator>Megarity, Jr. William M</creator><creator>Remis Luke D</creator><creator>Sellman Gregory D</creator><scope>EVB</scope></search><sort><creationdate>20180313</creationdate><title>Multicomponent heat sink with movable fin support portion</title><author>Megarity, Jr. William M ; Remis Luke D ; Sellman Gregory D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9917033B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>Megarity, Jr. William M</creatorcontrib><creatorcontrib>Remis Luke D</creatorcontrib><creatorcontrib>Sellman Gregory D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Megarity, Jr. William M</au><au>Remis Luke D</au><au>Sellman Gregory D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multicomponent heat sink with movable fin support portion</title><date>2018-03-13</date><risdate>2018</risdate><abstract>A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Multicomponent heat sink with movable fin support portion |
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