Electronic module

An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Schiemann Thomas, Orcic Krunoslac, Kraft Guenther, Noshadi Valod, Berthomier Didier
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.