Field effect transistor having a multi-width electrode structure and method for manufacturing the same
A field effect transistor is manufactured by firstly forming an epitaxial layer on a substrate. Then, a trench having an oxide layer is formed on the epitaxial layer. The oxide layer has a first electrode portion having a first width and a first height and a second electrode portion having a second...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Amanullah Mohammad Liang Shu-Siang Yang Po-Wen Mrinal Aryadeep Tsai Yi-Lung |
description | A field effect transistor is manufactured by firstly forming an epitaxial layer on a substrate. Then, a trench having an oxide layer is formed on the epitaxial layer. The oxide layer has a first electrode portion having a first width and a first height and a second electrode portion having a second width and a second height. A gate oxide layer covering the oxide layer and the second electrode portion has a gate portion having a third width. The epitaxial layer has a body region and a source region, where these two regions are adjacent to the gate portion and covered by an interlayer dielectric. A source electrode covering the body region and the interlayer dielectric contacts the source region. The first height is no less than the second height, the first width is smaller than the second width, and the second width is smaller than the third width. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9905690B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9905690B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9905690B13</originalsourceid><addsrcrecordid>eNqNy0sKwjAUheFOHIi6h7uBQkUUOlUsztVxuTQnJpBHSW50-6bgAhydwfn-daMHC6cIWmMSksQh2ywxkeG3DS9i8sWJbT9WiSG4qlJUoCypTFISiIMiDzFRka6d51A0L9eSi6mUPbbNSrPL2P1209BwfVxuLeY4Is88IUDG573vu-Op7877wx_kCyhlP8c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Field effect transistor having a multi-width electrode structure and method for manufacturing the same</title><source>esp@cenet</source><creator>Amanullah Mohammad ; Liang Shu-Siang ; Yang Po-Wen ; Mrinal Aryadeep ; Tsai Yi-Lung</creator><creatorcontrib>Amanullah Mohammad ; Liang Shu-Siang ; Yang Po-Wen ; Mrinal Aryadeep ; Tsai Yi-Lung</creatorcontrib><description>A field effect transistor is manufactured by firstly forming an epitaxial layer on a substrate. Then, a trench having an oxide layer is formed on the epitaxial layer. The oxide layer has a first electrode portion having a first width and a first height and a second electrode portion having a second width and a second height. A gate oxide layer covering the oxide layer and the second electrode portion has a gate portion having a third width. The epitaxial layer has a body region and a source region, where these two regions are adjacent to the gate portion and covered by an interlayer dielectric. A source electrode covering the body region and the interlayer dielectric contacts the source region. The first height is no less than the second height, the first width is smaller than the second width, and the second width is smaller than the third width.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180227&DB=EPODOC&CC=US&NR=9905690B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180227&DB=EPODOC&CC=US&NR=9905690B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Amanullah Mohammad</creatorcontrib><creatorcontrib>Liang Shu-Siang</creatorcontrib><creatorcontrib>Yang Po-Wen</creatorcontrib><creatorcontrib>Mrinal Aryadeep</creatorcontrib><creatorcontrib>Tsai Yi-Lung</creatorcontrib><title>Field effect transistor having a multi-width electrode structure and method for manufacturing the same</title><description>A field effect transistor is manufactured by firstly forming an epitaxial layer on a substrate. Then, a trench having an oxide layer is formed on the epitaxial layer. The oxide layer has a first electrode portion having a first width and a first height and a second electrode portion having a second width and a second height. A gate oxide layer covering the oxide layer and the second electrode portion has a gate portion having a third width. The epitaxial layer has a body region and a source region, where these two regions are adjacent to the gate portion and covered by an interlayer dielectric. A source electrode covering the body region and the interlayer dielectric contacts the source region. The first height is no less than the second height, the first width is smaller than the second width, and the second width is smaller than the third width.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy0sKwjAUheFOHIi6h7uBQkUUOlUsztVxuTQnJpBHSW50-6bgAhydwfn-daMHC6cIWmMSksQh2ywxkeG3DS9i8sWJbT9WiSG4qlJUoCypTFISiIMiDzFRka6d51A0L9eSi6mUPbbNSrPL2P1209BwfVxuLeY4Is88IUDG573vu-Op7877wx_kCyhlP8c</recordid><startdate>20180227</startdate><enddate>20180227</enddate><creator>Amanullah Mohammad</creator><creator>Liang Shu-Siang</creator><creator>Yang Po-Wen</creator><creator>Mrinal Aryadeep</creator><creator>Tsai Yi-Lung</creator><scope>EVB</scope></search><sort><creationdate>20180227</creationdate><title>Field effect transistor having a multi-width electrode structure and method for manufacturing the same</title><author>Amanullah Mohammad ; Liang Shu-Siang ; Yang Po-Wen ; Mrinal Aryadeep ; Tsai Yi-Lung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9905690B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Amanullah Mohammad</creatorcontrib><creatorcontrib>Liang Shu-Siang</creatorcontrib><creatorcontrib>Yang Po-Wen</creatorcontrib><creatorcontrib>Mrinal Aryadeep</creatorcontrib><creatorcontrib>Tsai Yi-Lung</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Amanullah Mohammad</au><au>Liang Shu-Siang</au><au>Yang Po-Wen</au><au>Mrinal Aryadeep</au><au>Tsai Yi-Lung</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Field effect transistor having a multi-width electrode structure and method for manufacturing the same</title><date>2018-02-27</date><risdate>2018</risdate><abstract>A field effect transistor is manufactured by firstly forming an epitaxial layer on a substrate. Then, a trench having an oxide layer is formed on the epitaxial layer. The oxide layer has a first electrode portion having a first width and a first height and a second electrode portion having a second width and a second height. A gate oxide layer covering the oxide layer and the second electrode portion has a gate portion having a third width. The epitaxial layer has a body region and a source region, where these two regions are adjacent to the gate portion and covered by an interlayer dielectric. A source electrode covering the body region and the interlayer dielectric contacts the source region. The first height is no less than the second height, the first width is smaller than the second width, and the second width is smaller than the third width.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US9905690B1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Field effect transistor having a multi-width electrode structure and method for manufacturing the same |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T11%3A09%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Amanullah%20Mohammad&rft.date=2018-02-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9905690B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |