Electronic component package and method of manufacturing the same

Electronic component package and method of manufacturing the same

An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.

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Hauptverfasser: Kim Sun Ho, Kim Ji Hoon, Oh Kyung Seob, Harr Kyoung Moo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Kim Sun Ho
Kim Ji Hoon
Oh Kyung Seob
Harr Kyoung Moo
description An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9905526B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9905526B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9905526B23</originalsourceid><addsrcrecordid>eNrjZHB0zUlNLinKz8tMVkjOzy3Iz0vNK1EoSEzOTkxPVUjMS1HITS3JyE9RyE9TyE3MK01LTC4pLcrMS1coyUhVKE7MTeVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQKNS81JL4kODLS0NTE2NzJyMjIlQAgC2eTGN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component package and method of manufacturing the same</title><source>esp@cenet</source><creator>Kim Sun Ho ; Kim Ji Hoon ; Oh Kyung Seob ; Harr Kyoung Moo</creator><creatorcontrib>Kim Sun Ho ; Kim Ji Hoon ; Oh Kyung Seob ; Harr Kyoung Moo</creatorcontrib><description>An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180227&amp;DB=EPODOC&amp;CC=US&amp;NR=9905526B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180227&amp;DB=EPODOC&amp;CC=US&amp;NR=9905526B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim Sun Ho</creatorcontrib><creatorcontrib>Kim Ji Hoon</creatorcontrib><creatorcontrib>Oh Kyung Seob</creatorcontrib><creatorcontrib>Harr Kyoung Moo</creatorcontrib><title>Electronic component package and method of manufacturing the same</title><description>An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0zUlNLinKz8tMVkjOzy3Iz0vNK1EoSEzOTkxPVUjMS1HITS3JyE9RyE9TyE3MK01LTC4pLcrMS1coyUhVKE7MTeVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQKNS81JL4kODLS0NTE2NzJyMjIlQAgC2eTGN</recordid><startdate>20180227</startdate><enddate>20180227</enddate><creator>Kim Sun Ho</creator><creator>Kim Ji Hoon</creator><creator>Oh Kyung Seob</creator><creator>Harr Kyoung Moo</creator><scope>EVB</scope></search><sort><creationdate>20180227</creationdate><title>Electronic component package and method of manufacturing the same</title><author>Kim Sun Ho ; Kim Ji Hoon ; Oh Kyung Seob ; Harr Kyoung Moo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9905526B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim Sun Ho</creatorcontrib><creatorcontrib>Kim Ji Hoon</creatorcontrib><creatorcontrib>Oh Kyung Seob</creatorcontrib><creatorcontrib>Harr Kyoung Moo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim Sun Ho</au><au>Kim Ji Hoon</au><au>Oh Kyung Seob</au><au>Harr Kyoung Moo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component package and method of manufacturing the same</title><date>2018-02-27</date><risdate>2018</risdate><abstract>An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.</abstract><oa>free_for_read</oa></addata></record>
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language eng
recordid cdi_epo_espacenet_US9905526B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Electronic component package and method of manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T19%3A44%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim%20Sun%20Ho&rft.date=2018-02-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9905526B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true