Light emitting device having silicone resin-based sealing member

Light emitting device having silicone resin-based sealing member

A light emitting device includes at least one light emitting element including a plurality of semiconductor layers; and a light transmissive sealing member covering the at least one light emitting element. The light transmissive sealing member comprises a light transmissive sealing resin containing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ichikawa Hirofumi, Kuramoto Masafumi, Tanisada Tomoki, Shimizu Yasunori
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ichikawa Hirofumi
Kuramoto Masafumi
Tanisada Tomoki
Shimizu Yasunori
description A light emitting device includes at least one light emitting element including a plurality of semiconductor layers; and a light transmissive sealing member covering the at least one light emitting element. The light transmissive sealing member comprises a light transmissive sealing resin containing a silicone resin having a siloxane bond scaffold having methyl and phenyl groups as a principal ingredient. The light transmissive sealing resin has a refractive index in a range between 1.45 and 1.52, a durometer type D hardness at 25° C. specified by JIS K 6253 in a range between 20 and 70, and a DMA tan δ-based glass transition temperature (Tg) in a range between 20° C. and 70° C.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9893250B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9893250B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9893250B13</originalsourceid><addsrcrecordid>eNrjZHDwyUzPKFFIzc0sKcnMS1dISS3LTE5VyEgsA_GKM3Myk_PzUhWKUosz83STEotTUxSKUxNzQJK5qblJqUU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjSwtLYyNTAydCYCCUAc-wxIw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting device having silicone resin-based sealing member</title><source>esp@cenet</source><creator>Ichikawa Hirofumi ; Kuramoto Masafumi ; Tanisada Tomoki ; Shimizu Yasunori</creator><creatorcontrib>Ichikawa Hirofumi ; Kuramoto Masafumi ; Tanisada Tomoki ; Shimizu Yasunori</creatorcontrib><description>A light emitting device includes at least one light emitting element including a plurality of semiconductor layers; and a light transmissive sealing member covering the at least one light emitting element. The light transmissive sealing member comprises a light transmissive sealing resin containing a silicone resin having a siloxane bond scaffold having methyl and phenyl groups as a principal ingredient. The light transmissive sealing resin has a refractive index in a range between 1.45 and 1.52, a durometer type D hardness at 25° C. specified by JIS K 6253 in a range between 20 and 70, and a DMA tan δ-based glass transition temperature (Tg) in a range between 20° C. and 70° C.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180213&amp;DB=EPODOC&amp;CC=US&amp;NR=9893250B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180213&amp;DB=EPODOC&amp;CC=US&amp;NR=9893250B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ichikawa Hirofumi</creatorcontrib><creatorcontrib>Kuramoto Masafumi</creatorcontrib><creatorcontrib>Tanisada Tomoki</creatorcontrib><creatorcontrib>Shimizu Yasunori</creatorcontrib><title>Light emitting device having silicone resin-based sealing member</title><description>A light emitting device includes at least one light emitting element including a plurality of semiconductor layers; and a light transmissive sealing member covering the at least one light emitting element. The light transmissive sealing member comprises a light transmissive sealing resin containing a silicone resin having a siloxane bond scaffold having methyl and phenyl groups as a principal ingredient. The light transmissive sealing resin has a refractive index in a range between 1.45 and 1.52, a durometer type D hardness at 25° C. specified by JIS K 6253 in a range between 20 and 70, and a DMA tan δ-based glass transition temperature (Tg) in a range between 20° C. and 70° C.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwyUzPKFFIzc0sKcnMS1dISS3LTE5VyEgsA_GKM3Myk_PzUhWKUosz83STEotTUxSKUxNzQJK5qblJqUU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjSwtLYyNTAydCYCCUAc-wxIw</recordid><startdate>20180213</startdate><enddate>20180213</enddate><creator>Ichikawa Hirofumi</creator><creator>Kuramoto Masafumi</creator><creator>Tanisada Tomoki</creator><creator>Shimizu Yasunori</creator><scope>EVB</scope></search><sort><creationdate>20180213</creationdate><title>Light emitting device having silicone resin-based sealing member</title><author>Ichikawa Hirofumi ; Kuramoto Masafumi ; Tanisada Tomoki ; Shimizu Yasunori</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9893250B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ichikawa Hirofumi</creatorcontrib><creatorcontrib>Kuramoto Masafumi</creatorcontrib><creatorcontrib>Tanisada Tomoki</creatorcontrib><creatorcontrib>Shimizu Yasunori</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ichikawa Hirofumi</au><au>Kuramoto Masafumi</au><au>Tanisada Tomoki</au><au>Shimizu Yasunori</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting device having silicone resin-based sealing member</title><date>2018-02-13</date><risdate>2018</risdate><abstract>A light emitting device includes at least one light emitting element including a plurality of semiconductor layers; and a light transmissive sealing member covering the at least one light emitting element. The light transmissive sealing member comprises a light transmissive sealing resin containing a silicone resin having a siloxane bond scaffold having methyl and phenyl groups as a principal ingredient. The light transmissive sealing resin has a refractive index in a range between 1.45 and 1.52, a durometer type D hardness at 25° C. specified by JIS K 6253 in a range between 20 and 70, and a DMA tan δ-based glass transition temperature (Tg) in a range between 20° C. and 70° C.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US9893250B1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting device having silicone resin-based sealing member
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T12%3A14%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ichikawa%20Hirofumi&rft.date=2018-02-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9893250B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true