Semiconductor light-emitting device package

A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ko Geun Woo, Kwon Yong Min, Lee Jun Ho, Chung Jin Wook, Woo Ah Young, Choi Pun Jae
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ko Geun Woo
Kwon Yong Min
Lee Jun Ho
Chung Jin Wook
Woo Ah Young
Choi Pun Jae
description A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9887332B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9887332B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9887332B23</originalsourceid><addsrcrecordid>eNrjZNAOTs3NTM7PSylNLskvUsjJTM8o0QUKlZRk5qUrpKSWZSanKhQkJmcnpqfyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjUYqCq1LzUkvjQYEsLC3NjYyMnI2MilAAAQJMplQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor light-emitting device package</title><source>esp@cenet</source><creator>Ko Geun Woo ; Kwon Yong Min ; Lee Jun Ho ; Chung Jin Wook ; Woo Ah Young ; Choi Pun Jae</creator><creatorcontrib>Ko Geun Woo ; Kwon Yong Min ; Lee Jun Ho ; Chung Jin Wook ; Woo Ah Young ; Choi Pun Jae</creatorcontrib><description>A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180206&amp;DB=EPODOC&amp;CC=US&amp;NR=9887332B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180206&amp;DB=EPODOC&amp;CC=US&amp;NR=9887332B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ko Geun Woo</creatorcontrib><creatorcontrib>Kwon Yong Min</creatorcontrib><creatorcontrib>Lee Jun Ho</creatorcontrib><creatorcontrib>Chung Jin Wook</creatorcontrib><creatorcontrib>Woo Ah Young</creatorcontrib><creatorcontrib>Choi Pun Jae</creatorcontrib><title>Semiconductor light-emitting device package</title><description>A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAOTs3NTM7PSylNLskvUsjJTM8o0QUKlZRk5qUrpKSWZSanKhQkJmcnpqfyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjUYqCq1LzUkvjQYEsLC3NjYyMnI2MilAAAQJMplQ</recordid><startdate>20180206</startdate><enddate>20180206</enddate><creator>Ko Geun Woo</creator><creator>Kwon Yong Min</creator><creator>Lee Jun Ho</creator><creator>Chung Jin Wook</creator><creator>Woo Ah Young</creator><creator>Choi Pun Jae</creator><scope>EVB</scope></search><sort><creationdate>20180206</creationdate><title>Semiconductor light-emitting device package</title><author>Ko Geun Woo ; Kwon Yong Min ; Lee Jun Ho ; Chung Jin Wook ; Woo Ah Young ; Choi Pun Jae</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9887332B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ko Geun Woo</creatorcontrib><creatorcontrib>Kwon Yong Min</creatorcontrib><creatorcontrib>Lee Jun Ho</creatorcontrib><creatorcontrib>Chung Jin Wook</creatorcontrib><creatorcontrib>Woo Ah Young</creatorcontrib><creatorcontrib>Choi Pun Jae</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ko Geun Woo</au><au>Kwon Yong Min</au><au>Lee Jun Ho</au><au>Chung Jin Wook</au><au>Woo Ah Young</au><au>Choi Pun Jae</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor light-emitting device package</title><date>2018-02-06</date><risdate>2018</risdate><abstract>A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US9887332B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor light-emitting device package
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T12%3A44%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ko%20Geun%20Woo&rft.date=2018-02-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9887332B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true