Pressure-sensitive hot melt adhesive compositions

The present invention is related to pressure-sensitive hot melt adhesive compositions and their applications. In particular, the adhesive compositions described herein comprise a block copolymer component, a hydrocarbon tackifier resin component, and a propylene-based polymer component.

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Bibliographische Detailangaben
Hauptverfasser:	Swiggers Eddy, Schroeyers Jurgen
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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