LC filter layer stacking by layer transfer to make 3D multiplexer structures

A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Berdy David Francis, Kim Daeik Daniel, Zuo Chengjie, Mikulka Robert Paul, Mudakatte Niranjan Sunil, Velez Mario Francisco, Yun Changhan Hobie
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Berdy David Francis
Kim Daeik Daniel
Zuo Chengjie
Mikulka Robert Paul
Mudakatte Niranjan Sunil
Velez Mario Francisco
Yun Changhan Hobie
description A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9876513B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9876513B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9876513B23</originalsourceid><addsrcrecordid>eNrjZPDxcVZIy8wpSS1SyEmsBJLFJYnJ2Zl56QpJlVCRkqLEvOI0ECNfITcxO1XB2EUhtzSnJLMgJ7UCrKOoNLmktCi1mIeBNS0xpziVF0pzMyi4uYY4e-imFuTHpxYXJCan5qWWxIcGW1qYm5kaGjsZGROhBAADGzVt</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LC filter layer stacking by layer transfer to make 3D multiplexer structures</title><source>esp@cenet</source><creator>Berdy David Francis ; Kim Daeik Daniel ; Zuo Chengjie ; Mikulka Robert Paul ; Mudakatte Niranjan Sunil ; Velez Mario Francisco ; Yun Changhan Hobie</creator><creatorcontrib>Berdy David Francis ; Kim Daeik Daniel ; Zuo Chengjie ; Mikulka Robert Paul ; Mudakatte Niranjan Sunil ; Velez Mario Francisco ; Yun Changhan Hobie</creatorcontrib><description>A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.</description><language>eng</language><subject>BASIC ELECTRONIC CIRCUITRY ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; TRANSMISSION</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180123&amp;DB=EPODOC&amp;CC=US&amp;NR=9876513B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180123&amp;DB=EPODOC&amp;CC=US&amp;NR=9876513B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Berdy David Francis</creatorcontrib><creatorcontrib>Kim Daeik Daniel</creatorcontrib><creatorcontrib>Zuo Chengjie</creatorcontrib><creatorcontrib>Mikulka Robert Paul</creatorcontrib><creatorcontrib>Mudakatte Niranjan Sunil</creatorcontrib><creatorcontrib>Velez Mario Francisco</creatorcontrib><creatorcontrib>Yun Changhan Hobie</creatorcontrib><title>LC filter layer stacking by layer transfer to make 3D multiplexer structures</title><description>A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDxcVZIy8wpSS1SyEmsBJLFJYnJ2Zl56QpJlVCRkqLEvOI0ECNfITcxO1XB2EUhtzSnJLMgJ7UCrKOoNLmktCi1mIeBNS0xpziVF0pzMyi4uYY4e-imFuTHpxYXJCan5qWWxIcGW1qYm5kaGjsZGROhBAADGzVt</recordid><startdate>20180123</startdate><enddate>20180123</enddate><creator>Berdy David Francis</creator><creator>Kim Daeik Daniel</creator><creator>Zuo Chengjie</creator><creator>Mikulka Robert Paul</creator><creator>Mudakatte Niranjan Sunil</creator><creator>Velez Mario Francisco</creator><creator>Yun Changhan Hobie</creator><scope>EVB</scope></search><sort><creationdate>20180123</creationdate><title>LC filter layer stacking by layer transfer to make 3D multiplexer structures</title><author>Berdy David Francis ; Kim Daeik Daniel ; Zuo Chengjie ; Mikulka Robert Paul ; Mudakatte Niranjan Sunil ; Velez Mario Francisco ; Yun Changhan Hobie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9876513B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>Berdy David Francis</creatorcontrib><creatorcontrib>Kim Daeik Daniel</creatorcontrib><creatorcontrib>Zuo Chengjie</creatorcontrib><creatorcontrib>Mikulka Robert Paul</creatorcontrib><creatorcontrib>Mudakatte Niranjan Sunil</creatorcontrib><creatorcontrib>Velez Mario Francisco</creatorcontrib><creatorcontrib>Yun Changhan Hobie</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Berdy David Francis</au><au>Kim Daeik Daniel</au><au>Zuo Chengjie</au><au>Mikulka Robert Paul</au><au>Mudakatte Niranjan Sunil</au><au>Velez Mario Francisco</au><au>Yun Changhan Hobie</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LC filter layer stacking by layer transfer to make 3D multiplexer structures</title><date>2018-01-23</date><risdate>2018</risdate><abstract>A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US9876513B2
source esp@cenet
subjects BASIC ELECTRONIC CIRCUITRY
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
TRANSMISSION
title LC filter layer stacking by layer transfer to make 3D multiplexer structures
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T13%3A06%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Berdy%20David%20Francis&rft.date=2018-01-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9876513B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true