Method and system for detecting defects of wafer by wafer sort

A method for detecting defects of wafer by wafer sort is introduced. In the method, a wafer sort testing apparatus is used to obtain a DTL or ADART result, wherein a plurality of repaired sites in a wafer is highlighted according to the DTL or ADART result. A plurality of physical locations of the r...

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Hauptverfasser:	Yang Ling-Wuu, Chen Kuang-Chao, Huang I-Jen, Luoh Tuung, Yang Ta-Hone
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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creator	Yang Ling-Wuu Chen Kuang-Chao Huang I-Jen Luoh Tuung Yang Ta-Hone
description	A method for detecting defects of wafer by wafer sort is introduced. In the method, a wafer sort testing apparatus is used to obtain a DTL or ADART result, wherein a plurality of repaired sites in a wafer is highlighted according to the DTL or ADART result. A plurality of physical locations of the repaired sites is then output. An analysis equipment is used to match the physical locations with a graphic data system (GDS) design layout coordinate of the wafer so as to generate a data correlating with defects at the repaired sites.
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subjects	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
title	Method and system for detecting defects of wafer by wafer sort
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