Bumpless build-up layer package with pre-stacked microelectronic devices

The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of fabricating microelectronic packages, wherein a first microelectronic dev...

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Bibliographische Detailangaben
1. Verfasser: Malatkar Pramod
Format: Patent
Sprache:eng
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