Light-mixing multichip package structure

A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chung Chia-Tin, Tai Shih-Neng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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