Semiconductor packages including thermal blocks

Semiconductor packages including thermal blocks

A semiconductor package includes a package substrate including a first region, a thermal block penetrating the first region and exposed at top and bottom surfaces of the package substrate, a semiconductor chip on the package substrate, bumps disposed between the package substrate and the semiconduct...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Moon HyunJong, Kim Keung Beum, Cha Seung-Yong, Kim Yonghoon, Lee Heeseok
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Moon HyunJong
Kim Keung Beum
Cha Seung-Yong
Kim Yonghoon
Lee Heeseok
description A semiconductor package includes a package substrate including a first region, a thermal block penetrating the first region and exposed at top and bottom surfaces of the package substrate, a semiconductor chip on the package substrate, bumps disposed between the package substrate and the semiconductor chip and including first bumps being in contact with the thermal block, and terminals disposed on the bottom surface of the package substrate and including first terminals being in contact with the thermal block. The thermal block is one of a power path and a ground path.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9799591B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9799591B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9799591B23</originalsourceid><addsrcrecordid>eNrjZNAPTs3NTM7PSylNLskvUihITM5OTE8tVsjMS84pTcnMS1coyUgtyk3MUUjKyU_OLuZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQP2peakl8aHBluaWlqaWhk5GxkQoAQAZECtQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor packages including thermal blocks</title><source>esp@cenet</source><creator>Moon HyunJong ; Kim Keung Beum ; Cha Seung-Yong ; Kim Yonghoon ; Lee Heeseok</creator><creatorcontrib>Moon HyunJong ; Kim Keung Beum ; Cha Seung-Yong ; Kim Yonghoon ; Lee Heeseok</creatorcontrib><description>A semiconductor package includes a package substrate including a first region, a thermal block penetrating the first region and exposed at top and bottom surfaces of the package substrate, a semiconductor chip on the package substrate, bumps disposed between the package substrate and the semiconductor chip and including first bumps being in contact with the thermal block, and terminals disposed on the bottom surface of the package substrate and including first terminals being in contact with the thermal block. The thermal block is one of a power path and a ground path.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171024&amp;DB=EPODOC&amp;CC=US&amp;NR=9799591B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171024&amp;DB=EPODOC&amp;CC=US&amp;NR=9799591B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Moon HyunJong</creatorcontrib><creatorcontrib>Kim Keung Beum</creatorcontrib><creatorcontrib>Cha Seung-Yong</creatorcontrib><creatorcontrib>Kim Yonghoon</creatorcontrib><creatorcontrib>Lee Heeseok</creatorcontrib><title>Semiconductor packages including thermal blocks</title><description>A semiconductor package includes a package substrate including a first region, a thermal block penetrating the first region and exposed at top and bottom surfaces of the package substrate, a semiconductor chip on the package substrate, bumps disposed between the package substrate and the semiconductor chip and including first bumps being in contact with the thermal block, and terminals disposed on the bottom surface of the package substrate and including first terminals being in contact with the thermal block. The thermal block is one of a power path and a ground path.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPTs3NTM7PSylNLskvUihITM5OTE8tVsjMS84pTcnMS1coyUgtyk3MUUjKyU_OLuZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQP2peakl8aHBluaWlqaWhk5GxkQoAQAZECtQ</recordid><startdate>20171024</startdate><enddate>20171024</enddate><creator>Moon HyunJong</creator><creator>Kim Keung Beum</creator><creator>Cha Seung-Yong</creator><creator>Kim Yonghoon</creator><creator>Lee Heeseok</creator><scope>EVB</scope></search><sort><creationdate>20171024</creationdate><title>Semiconductor packages including thermal blocks</title><author>Moon HyunJong ; Kim Keung Beum ; Cha Seung-Yong ; Kim Yonghoon ; Lee Heeseok</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9799591B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Moon HyunJong</creatorcontrib><creatorcontrib>Kim Keung Beum</creatorcontrib><creatorcontrib>Cha Seung-Yong</creatorcontrib><creatorcontrib>Kim Yonghoon</creatorcontrib><creatorcontrib>Lee Heeseok</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Moon HyunJong</au><au>Kim Keung Beum</au><au>Cha Seung-Yong</au><au>Kim Yonghoon</au><au>Lee Heeseok</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor packages including thermal blocks</title><date>2017-10-24</date><risdate>2017</risdate><abstract>A semiconductor package includes a package substrate including a first region, a thermal block penetrating the first region and exposed at top and bottom surfaces of the package substrate, a semiconductor chip on the package substrate, bumps disposed between the package substrate and the semiconductor chip and including first bumps being in contact with the thermal block, and terminals disposed on the bottom surface of the package substrate and including first terminals being in contact with the thermal block. The thermal block is one of a power path and a ground path.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US9799591B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor packages including thermal blocks
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T05%3A46%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Moon%20HyunJong&rft.date=2017-10-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9799591B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true