Capacitive microphone with integrated cavity

A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Arnold David Patrick, Sheplak Mark
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Arnold David Patrick Sheplak Mark
description	A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9794711B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9794711B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9794711B23</originalsourceid><addsrcrecordid>eNrjZNBxTixITM4sySxLVcjNTC7KL8jIz0tVKM8syVDIzCtJTS9KLElNUUhOLMssqeRhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQINS81JL4kODLc0tTcwNDZ2MjIlQAgB32ioR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Capacitive microphone with integrated cavity</title><source>esp@cenet</source><creator>Arnold David Patrick ; Sheplak Mark</creator><creatorcontrib>Arnold David Patrick ; Sheplak Mark</creatorcontrib><description>A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171017&DB=EPODOC&CC=US&NR=9794711B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171017&DB=EPODOC&CC=US&NR=9794711B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Arnold David Patrick</creatorcontrib><creatorcontrib>Sheplak Mark</creatorcontrib><title>Capacitive microphone with integrated cavity</title><description>A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBxTixITM4sySxLVcjNTC7KL8jIz0tVKM8syVDIzCtJTS9KLElNUUhOLMssqeRhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQINS81JL4kODLc0tTcwNDZ2MjIlQAgB32ioR</recordid><startdate>20171017</startdate><enddate>20171017</enddate><creator>Arnold David Patrick</creator><creator>Sheplak Mark</creator><scope>EVB</scope></search><sort><creationdate>20171017</creationdate><title>Capacitive microphone with integrated cavity</title><author>Arnold David Patrick ; Sheplak Mark</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9794711B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>Arnold David Patrick</creatorcontrib><creatorcontrib>Sheplak Mark</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Arnold David Patrick</au><au>Sheplak Mark</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Capacitive microphone with integrated cavity</title><date>2017-10-17</date><risdate>2017</risdate><abstract>A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US9794711B2
source	esp@cenet
subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS
title	Capacitive microphone with integrated cavity
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T00%3A37%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Arnold%20David%20Patrick&rft.date=2017-10-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9794711B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true