Self-alignment for redistribution layer

An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs eac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yang Ku-Feng, Chung Ming-Tsu, Wu Tsang-Jiuh, Shih Hong-Ye, Wu Jiung, Tsai Chen-Yu, Chen Hsin-Yu, Chiou Wen-Chih
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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